Global Yield Automation & Data Modeling Engineer

Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek an Automation and Data Modelling Process Integration Development Engineer for our FSM HVM Global Yield organization, reporting to FEOL Process Integration Engineering Development Manager. Selected candidates will work with other members in FEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers. Automation and Data Modelling Integration Development Engineer's responsibilities include (but not limited to): Own engineering automation projects to execute HVM yield roadmap, device targeting and attain performance targets. Data Automation: Designing and implementing automated data pipelines for semiconductor manufacturing processes. Collaborating with cross-functional teams to streamline data collection, processing, and analysis. Data Modelling: Developing predictive models for semiconductor yield optimization, defect detection, and process improvement. Utilizing machine learning techniques to analyse large datasets and extract valuable insights. Experience in multivariate analysis like CCA, Factor Analysis and PCA. Collaborate with Technology Development and Local Yield teams to import new technology to production fabs. Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases. Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost. Engineering support for technical interactions with internal and external customers. Qualifications Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field 2+ years of experience on Device Physics and experience in advanced nodes (FinFET technology, GAA (Gate-All-Around)) in development or high-volume manufacturing. Experience in programming languages such as Python, R, or MATLAB. Experience with semiconductor manufacturing data, process automation, and multivariate statistical modeling. Experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology Preferred Qualifications: Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field Experience in Machine Learning methodologies (Bayesian, PCA, Kalman Filter, SVM etc.) Experience in serving external Foundry customers through technical interactions. Working level experience in algorithm customization of Bayesian, Cluster analysis, Factor Analysis, PCA, CCA, SEM and MANOVA Experience in project/program management and/or Task Force Team lead. Experience leveraging big data analysis to identify process design weaknesses and/or manufacturing weaknesses in order to propose corrective, data-based solutions. Experience extracting insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics and machine learning. Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. #J-18808-Ljbffr Intel Corporation