Monolithic Microwave Integrated Circuit (MMIC) Manufacturing Engineer (Associate or Mid-Level)

Job Overview Monolithic Microwave Integrated Circuit (MMIC) Manufacturing Engineer (Associate or Mid‑Level) at The Boeing Company, based out of El Segundo, CA, supports board‑level assembly and test processes for MMIC‑based modules from equipment setup and programming through troubleshooting and continuous improvement of production equipment. Position Responsibilities Establish procedures, standards, protocols, and reporting requirements for board assembly and test operations. Utilize lean manufacturing tools and recommend improvements in production methods, tooling, equipment, layout, product designs, and performance efficiency. Support engineering and manufacturing activities, including programming, calibrating, and operating equipment used to build MMIC modules. Develop preventive maintenance plans, troubleshoot, and support repairs on production equipment. Design and modify tooling, stencils, and shop aids for assembly processes such as dispense fixtures, bond frames, and custom pallets. Develop rework/repair thermal and bonding profiles for electronic assemblies. Configure and optimize production equipment and process recipes for building electronics assemblies and support new design requirements. Maintain build schedule targets while resolving production issues and upholding manufacturing and design requirements. Facilitate close relationships with design, test, and quality teams during design, build, and test to provide continuous feedback for design improvement and producibility. Develop and execute Statistical Process Control (SPC) for manufacturing processes and maintain manufacturing metrics (yield, DPPM, cycle time). Work with design teams on manufacturing problems, parts obsolescence, and requirement changes. Support the transition of products from development to volume production and identify continuous improvement opportunities for yield, performance, and cost. Support incoming inspection, nonconformance disposition, and supplier interactions for components and materials used in assembly. Equipment and Process Tools Dispense and pick (DAP) systems, pick‑and‑place machines, and dispensing systems (solder paste, adhesive, conductive). Plasma cleaning/activation systems. Automatic ball‑bond and wedge‑bond machines, beam‑lead diode bonder and manual wedge bonders. Centrifuge for potting/adhesive processing. Pull‑test equipment and force gauges. Optical inspection and functional test fixtures. Basic Qualifications Bachelor of Science degree in Engineering, Engineering Technology, Manufacturing Engineering Technology, Materials Science, Physics, Mathematics, Data Science, or Computer Science. At least 1 year of experience with circuit card and/or electronics manufacturing. Experience reading and interpreting engineering documents and drawings. Experience with data analysis tools. Experience with root‑cause corrective analysis. Preferred Qualifications 3+ years of related work experience or equivalent education and experience. 1+ years of related manufacturing or process engineering experience in electronics assembly or module production. Hands‑on experience with multiple items from the equipment list and demonstrated ability to configure/optimize production recipes and tooling. Ability to read and interpret engineering drawings, CAD files, and operation manuals. Strong data analysis and documentation skills (Excel, Minitab/JMP, Python). Practical experience applying DOE, SPC, FMEA, and root‑cause analysis to drive process improvements. Experience in aerospace, defense, or other high‑reliability electronics manufacturing environments. Knowledge of RF/MMIC assembly impacts on performance (bond inductance, solder voiding, thermal paths). Familiarity with EO/QA documentation and standards (AS9100, IPC‑A‑610) and MES/ERP systems. Experience with supplier qualification and incoming inspection processes. Interpersonal and communication skills to collaborate with teams and stakeholders at all levels. Work Hours This role is primarily second shift; additional shift may be required to support program objectives. Pay & Benefits At Boeing we offer competitive base pay and variable compensation. Eligible employees may enroll in health insurance, flexible spending accounts, and retirement savings plans. Salary ranges: Associate $90,950–$123,050; Mid‑Level $111,350–$150,650. Pay is based on experience and qualifications. EEO Statement Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, disability, military/veteran status, or other protected characteristics. EEO is the law. #J-18808-Ljbffr Boeing