Senior or Principal Technical Program Manager

Senior or Principal Technical Program Manager

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystemscatalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

TIE's 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Purpose

This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology. By orchestrating collaboration across internal teams and external partners, it ensures strategic alignment, timely execution, and clear communication of progress. The position also plays a key role in shaping program direction through industry insight and proactive problem-solving.

Responsibilities

• Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE's advanced microsystems roadmap.
• Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
• Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.
• Serve as the central liaison between TIE's technical teams, university researchers, and external stakeholdersincluding DoD partners, national labs, and commercial collaborators.
• Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
• Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
• Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
• Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy.
• Other related functions as assigned.

Required Qualifications

For Senior Technical Program Manager:

• Industry Experience: 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.

For Principal Technical Program Manager:

• Industry Experience: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.

For both levels:

• Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
• Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows.
• Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts.
• Startup DNA. You're energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren't afraid to wear many hats to get the job done.
• Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliverreliably and proactively.
• Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.
• Program Leadership: Proven program management chops you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders. You know how to define success metrics, manage interdependencies, and keep teams aligned and motivated even as projects grow in complexity.
• Vendor/Partner Management: Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.
• Industry Background: Prior experience at a leading semiconductor foundry or packaging house is a strong plus, giving you firsthand insight into advanced packaging processes and the broader industry ecosystem.

Salary Range

TIE Pays Industry-Competitive Salaries

Working Conditions

• May work around standard office conditions
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)

Work Shift

• Monday Friday: 8am to 5pm.
• Occasional/frequent nights/weekends required.
• Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible, with travel up to 3050% as needed. (Any flexible work arrangement such as hybrid work would be subject to university policies and approval regarding relation to jurisdictional employment-related laws, rules, and regulations.)

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of interest

The University of Texas at Austin Staff