IC Packaging Architect: Lead Advanced Packaging & Yield
Advanced Micro Devices
Advanced Micro Devices (AMD) is seeking a leader in Advanced Packaging Technology for driving packaging architecture across multiple product lines. In this hybrid role based in Austin, Texas, you will collaborate with product design and technology partners to define packaging roadmaps. The ideal candidate has extensive experience in semiconductor technology development and proven leadership in engineering teams. Communication skills are essential for sharing recommendations with various stakeholders. AMD offers an inclusive environment and various benefits to support our workforce. #J-18808-Ljbffr Advanced Micro Devices
Vacancy posted 2 days ago
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