Wafer Fabrication Process Technician (Photonics)

Job Description

Job Description

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team is shaping the future of our industry and share our passion to reveal the invisible!

• Preference will be given to candidates currently located within commutable distance to Salem, NH.

GPD Optoelectronics Corp. is seeking a Wafer Fab Process Tech. This is a production position, which will be involved in the wafer processing functions of dicing, scribing, testing, and certifying wafer lots at the back end of wafer fabrication. This is a position that requires tactile skill - hands on using tweezers to process semiconductor wafers in a semi-automated wafer fab with several manual operations involved, requiring an individual with ability to handle fragile parts, and keen awareness to quality and maintaining proper process conditions. GPD’s engineering teams utilize production staff for many projects – this role requires ability to understand written instructions and collaborate well in a team environment to support development tasks in addition to standard products.

Additional responsibilities, commensurate with experience and training, may include use of chemicals, and handling of wafers in operations such as photolithography, etch, PECVD, metallization, and wafer back grinding.

This full-time, non-exempt role is located in Salem, NH and will report to the Senior Wafer Fabrication Engineering Manager.

• Preference will be given to candidates within a commutable distance.

Interested applicants are asked to apply @: ir.com/company/careers/

ESSENTIAL FUNCTIONS:

Daily Operations include Wafer Thinning, Metallization, Dicing/Scribing, Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing.

Wafer fabrication, back end operations and testing of InGaAs and Germanium photodiodes, including other substrate materials.

Use of a computer for testing and work order entry or quality details.

Maintaining Lot traceability through back-end operations.

Manual handling of fragile parts.

Reporting of any problems or issues with supporting daily plans, and ability to carry out priorities as assigned to production lots or other support tasks.

Compliance and support for GPD’s quality policies.

Other tasks as assigned.

SKILLS & ABILITIES:

Attention to detail and good manual dexterity for handling of fragile substrates with tweezers.

Attention to process safety, operating instructions, and process conditions – this position requires Chemical handling and adherence to safety measures, use of PPE, and adherence to regulations.

Quality – microelectronics or photonic device inspection experience a plus

Able to follow MIL-STD requirements, cleanroom protocol, and specific product specifications.

LEAN OR Six Sigma experience desirable but not required.

EDUCATION, REQUIREMENTS, AND EXPERIENCE:

Ability to identify, multi-task, and resolve multiple priority issues quickly.

Ability to approach tasks in a detail-oriented manner.

Ability to work in teams and collaborate effectively with people in different functions.

Experience processing group III-V and IV semiconductors.

High School Diploma (or GED or High School Equivalence Certificate).

Salary commensurate with experience.

MISC:

Able to lift up to 25lbs.

This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include:

Hand Hygiene, Personal Item Removal, Gowning Area Preparation,

Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns,

Gloves, Additional Garments, Final Inspection and maintaining proper protocols.