Member of Technical Staff, Reliability Engineer

Lumotive is pioneering the era of programmable optics—where light is controlled as intelligently and flexibly as software.

At the heart of this transformation is a once-in-a-generation innovation: a flat CMOS-based “general purpose optic.” Lumotive’s Light Control Metasurface (LCM™) beam forming chips can be programmed to function as a beam steering mirror, a lens, mirror, a beam splitter—or any optical function—replacing bulky and mechanical optical components with a fully digital, reconfigurable semiconductor . This breakthrough lays the foundation for a massive shift in multiple technologies—from 3D sensing and imaging to optical networking, free space optical communication, and beyond. Like the shift from analog to digital in electronics, programmable optics will reshape industries from robotics, self-driving cars, AI, defense, and healthcare.

Lumotive’s first commercial application is in LiDAR, where its software-defined beam steering chips are already enabling compact, high-performance, solid-state sensors. These sensors are being deployed today in smart infrastructure, robotics, and mobility systems through leading module makers and solution integrators.

With more than 200 patents and growing commercial traction, Lumotive is delivering the world’s first digital platform for light—and redefining what’s possible in the optical age.

Job Description:

We are looking for a reliability engineer to own the reliability of the LCM itself — the chip at the core of everything Lumotive ships. The LCM is a new class of semiconductor device combining a CMOS backplane, novel thin-film material stacks, and liquid crystal, and it can fail in ways that go beyond the standard CMOS reliability playbook. This is not a turn-the-crank qualification role: some failure modes are unfamiliar, the acceleration models often have to be built from data we generate ourselves, and the person in this seat is expected to develop a deep, first-principles understanding of how and why LCMs fail.

You will design and run accelerated stress tests, perform hands-on failure analysis, build lifetime models, and correlate reliability outcomes back to wafer fab process splits, materials, and assembly. Just as importantly, you will look ahead for failure modes we have not characterized yet — anticipating how a new device in new use conditions can behave — so the team understands the risks early. Your findings will directly drive process, design, and materials decisions and help accelerate our ramp to high-volume production.