Senior Engineer
TalentAlly
Intel in the United States is seeking a Senior HBI Module Development Engineer to drive die-to-wafer hybrid bonding equipment development and manufacturability for next-generation packaging technologies. You will influence reliability, yield, and process maturity across development and high-volume manufacturing environments. You will lead DOE studies, engage with suppliers, and collaborate with cross-functional teams to push forward technology roadmaps for advanced packaging in AI and HPC #J-18808-Ljbffr
Vacancy posted 15 hours ago
Similar jobs that could be interesting for youBased on the Senior Engineer in Vernonia, OR vacancy
$172.2k - $243k
...The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high...SuggestedInternshipLocal areaTalentAlly
Vernonia, OR14 hours ago
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