Principal Technical Project Manager, ASIC

Senior Technical Project Manager, ASIC

San Jose, California, United States

Advancing the World's Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you'll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what's possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicated to empowering people to be their true selves. Together, we're building a better tomorrow for our employees, customers, partners, and communities.

What You'll Do

As a seasoned Senior Technical Project Manager (ASIC) you will lead complex silicon development projects from specification definition through tape-out, fabrication, and post-silicon validation. You will be the primary face of Samsung's (SLSI's) ASIC design, verification, physical design, firmware, foundry and advanced packaging teams to the customer and ensure the timely delivery of all collateral. This role requires a strong technical background in semiconductors combined with exceptional program management skills to navigate risks and drive execution excellence.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work Policy.

Reports to: Team leader/Head of Custom SoC Solutions Team.

Key Responsibilities

• End-to-End Program Ownership: Work with customers from initial concept and specification stage to silicon tape-out, bring-up, and production. This includes not only technical, but also spans commercial and legal domains.
• Project Planning & Scheduling: Develop and maintain detailed project plans, milestones, and resource allocation. Proactively identify and resolve bottlenecks and critical path issues.
• Cross-Functional Coordination: Collaborate with Architecture, RTL, Verification, Physical Design (PnR), DFT, Firmware, Emulation and Packaging teams to ensure aligned deliverables. Participate in cross functional meetings and identify and eliminate bottlenecks.
• Risk Management: Proactively identify risks and develop mitigation plans to avoid tape-out delays. Hold the development teams accountable for the scheduled quality deliverables.

What You Bring

• Education: Bachelor's degree in Electrical Engineering, Computer Engineering, or related field with 15+ years or a Master's degree with 13+ years.
• Experience: 10+ years in the semiconductor industry, with at least 5+ years in technical program/project management for ASIC/SoC products.
• Technical Knowledge: Deep understanding of the full ASIC design flow (RTL, Simulation, Synthesis, STA, PnR, DFT, Tape-out).
• Methodologies: Proven experience working with advanced process nodes and high-speed design.
• Tools: Proficiency in project management tools (Jira, Confluence, MS Project) and familiarity with EDA tools (Synopsys, Cadence).
• Experience with complex packaging (2.5D/3D IC, Si interposers, TSV).
• Knowledge of automotive functional safety and other automotive industry requirements
• Experience with hardware emulation platforms (Palladium, Veloce, ZeBu).
• Leadership: Strong ability to influence cross-functional teams without direct authority.
• Problem-Solving: Ability to analyze technical problems and drive solutions in a fast-paced environment.
• Communication: Excellent verbal and written communication skills, tailoring technical information for various stakeholders.
• You're inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.