Advanced Manufacturing RF Product Engineer

As an Advanced Producibility Engineer you will drive New Product Introduction (NPI) from RF MMIC design concept through high-volume production. In this role, you will combine deep RF circuit design expertise with strong productization experience to deliver high-performance, manufacturable solutions for advanced Defense Electronics applications. The position will co‑develop innovative, leading‑edge GaN and GaAs MMIC technologies supporting ground‑ and airborne‑based radars, electronic warfare, and space systems, spanning frequency ranges from L‑band through above Ka‑band. Responsibilities include assisting in architecture development and feasibility studies, performing detailed modeling, simulations, and analyses, and leading or supporting successful design reviews with both internal stakeholders and customers. Contributing to mask release, supporting manufacturing and test readiness, and working hands‑on design validation and device characterization will play a key role in bridging design and production—driving correlation between simulation and measured performance, improving yield, and ensuring designs meet reliability and quality standards. This role requires close collaboration across cross‑functional teams including systems, packaging, test, and manufacturing, as well as coordination with internal and external vendors. Additional responsibilities include preparing technical reports, supporting or leading IR&D efforts, and applying appropriate standards, processes, and tools throughout the system development lifecycle. You will report directly to our Engineering Program Manager, and you’ll work out of our Richardson, TX location on an On‑site work schedule. Responsibilities Lead and co‑develop advanced GaN/GaAs RF MMIC designs (LNAs, PAs, mixers, switches) for defense applications including radar, EW, and space systems from L‑band to above Ka‑band. Lead tape‑out and foundry engagement, preparing MMIC designs (GaAs, GaN, SiGe, CMOS) for fabrication, ensuring PDK compliance, manufacturability, and seamless coordination through mask release. Define architecture and translate product requirements into circuit specifications, feasibility studies, and optimized RF designs, balancing performance, cost, manufacturability, and reliability. Drive end‑to‑end NPI execution, including tape‑out ownership, mask release, foundry coordination, and adherence to program milestones and risk management. Develop and execute DFM/DFT strategies, characterization plans, and qualification activities (reliability, ESD, thermal, process variation) to ensure production readiness. Develop and maintain robust parts and materials processing guidelines, ensuring compliance with quality, traceability, and reliability requirements. Work hands‑on in the lab using PNA‑X and RF measurement equipment to support design introduction, validation, debug, and correlation between simulation, wafer probe, and final test data. Implement and monitor Statistical Process Control (SPC) methods to track key performance metrics, identify process variation, and drive data‑driven yield improvements. Conduct yield analysis, root‑cause investigation, and continuous improvement to resolve early production issues and ensure manufacturing compliance. Collaborate across cross‑functional teams and external partners, support IR&D and customer activities, and deliver complete technical documentation (reports, datasheets, readiness reviews) throughout the product lifecycle. Qualifications

YOU MUST HAVE

Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, mathematics. Three (3) + years NPI stage‑gate experience. Six Sigma Black Belt Certification. Two (2) + years’ experience in manufacturing or in a high‑tech electronics industry. Two (2) + years using SPC tools such as MiniTab, JMP, and Microsoft Office Suite including SharePoint and Excel. Proficiency interpreting schematics, technical drawings, and applying core electronics and microwave theory fundamentals to manufacturability concepts for transition to production. Ability to obtain and maintain a security clearance. We Value Proficiency using Computer‑aided design (CAD) software such as AutoCAD, SolidWorks, etc. Proficiency in working with DoD/military qualification and testing standards. Understanding of semiconductor fabrication processes and variability. Experience working with foundries on PDK usage, process corners and statistical analysis. Familiarity with yield analysis, test limits definition, and guard‑banding. Exposure to high‑volume manufacturing and product cost optimization. Strong collaboration skills with the ability to work cross‑functionally while also operating independently with accountability and initiative. Demonstrated adaptability, problem‑solving, and continuous improvement mindset, with strong organizational and time management skills in dynamic environments. Excellent written, verbal communication and presentation skills. Strong analytical skills, attention to detail, critical thinking. Benefits of Working for Honeywell In addition to a competitive salary, leading‑edge work, and developing solutions side‑by‑side with dedicated experts in their fields, Honeywell employees are eligible for a comprehensive benefits package. This package includes employer subsidized Medical, Dental, Vision, and Life Insurance; Short‑Term and Long‑Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance; Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. US Person Requirements Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status. #J-18808-Ljbffr Honeywell Aerospace US LLC