Senior Substrate IC & Packaging Design Engineer

ProFound People is seeking a high-impact engineer to help develop precision manufacturing processes for next-generation micro-scale technologies. You will play a key role in shaping next-generation packaging architectures and high-performance chip-to-chip integration solutions. The ideal candidate will have multi-year experience in substrate IC package design, strong background in advanced packaging architectures, and proficiency with Allegro Package Designer for constraint management and #J-18808-Ljbffr ProFound People