Electromechanical Packaging Engineer
American IT Systems
Position Summary
We are seeking an experienced Electromechanical Packaging Engineer to lead the design and development of electrical and mechanical packaging solutions for next-generation high-performance power tool systems and power electronics platforms. This role will focus on the integration of high-power-density electronics, electrical interconnects, antennas, sensors, batteries, and electromechanical components into compact, highly reliable products operating in harsh environments.
The ideal candidate will possess deep expertise in power electronics packaging, wire harness and electrical interconnect design, environmental protection, shock and vibration durability, regulatory compliance, design for assembly (DFA), and design for serviceability (DFS). This individual will work closely with electrical, mechanical, manufacturing, quality, and sourcing teams to develop robust and scalable product architectures from concept through production.
Key Responsibilities:
Lead the electromechanical packaging design of high-power-density electronic assemblies for professional and industrial power tool applications.
Develop packaging architectures for power electronics, motor controls, battery interfaces, RF systems, sensors, and communication modules.
Design and optimize electrical interconnect systems including:
Wire harnesses
Busbars
High-current connectors
PCB-to-PCB and PCB-to-wire interfaces
Grounding and shielding solutions
Develop packaging solutions capable of surviving demanding operating conditions including:
High shock and vibration
Dust and water ingress
Temperature extremes
Chemical exposure
Long-life cyclic loading environments
Drive Design for Assembly (DFA) initiatives to reduce manufacturing complexity, assembly time, and product cost.
Drive Design for Serviceability (DFS) to improve field repairability, maintenance access, and product lifecycle support.
Collaborate with manufacturing teams to develop efficient assembly processes and validate production readiness.
Define environmental sealing strategies including gaskets, overmolding, potting, conformal coating, and enclosure designs to achieve required IP ratings.
Partner with electrical engineering teams to ensure robust solutions for:
EMI/EMC compliance
ESD protection
Grounding strategies
Shielding effectiveness
Support packaging and placement of wireless communication systems, antennas, and RF components to optimize signal performance.
Conduct tolerance analyses, thermal studies, and packaging trade-off evaluations.
Support DFMEA, PFMEA, design reviews, and root cause investigations.
Interface with suppliers and manufacturing partners to develop scalable, cost-effective solutions.
Ensure designs comply with applicable global regulatory and product safety requirements.
Required Qualifications
Bachelor's degree in Mechanical Engineering, Electrical Engineering, Electromechanical Engineering, or related technical discipline.
Minimum 6 years of experience in electromechanical packaging, power electronics packaging, or related product development roles.
Proven experience packaging high-power electronic systems in compact, space-constrained products.
Strong knowledge of wire harness design, connector systems, and electrical interconnect architectures.
Experience designing products for:
Shock and vibration durability
Environmental sealing and protection
High-current applications
Harsh operating environments
Demonstrated application of Design for Assembly (DFA) and Design for Serviceability (DFS) principles.
Working knowledge of EMI, EMC, grounding, shielding, and ESD mitigation techniques.
Experience supporting regulatory compliance and product certification activities.
Proficiency with 3D CAD tools such as Creo, SolidWorks, NX, or equivalent.
Experience collaborating across mechanical, electrical, manufacturing, and quality engineering disciplines.
Preferred Qualifications:
Experience in the power tool, outdoor power equipment, industrial equipment, battery systems, or portable power industries.
Experience packaging:
Motor drives
Battery management systems (BMS)
Power conversion electronics
High-current battery interfaces
Knowledge of RF packaging and antenna integration for Bluetooth , Wi-Fi, UWB, cellular, or other wireless communication systems.
Familiarity with thermal management solutions for high-power-density electronics.
Experience with UL, IEC, CE, FCC, CSA, and other global compliance requirements.
Knowledge of IP-rated enclosure design and environmental qualification testing.
Familiarity with reliability engineering methodologies and accelerated life testing.
Success Factors:
The successful candidate will be a highly collaborative engineer who can balance performance, reliability, manufacturability, serviceability, cost, and regulatory requirements while developing robust packaging solutions for next-generation professional power products. The individual must be comfortable working in a fast-paced innovation environment and driving technical decisions across multiple engineering disciplines.
$75k - $95k
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