MGR II - R&D/Product Development Engineering (High Speed IO)

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. ​Job OverviewMGR II – R&D/Product Development Engineering (High Speed IO)BU and Function DescriptionThe High Speed IO engineering team within Digital Device Network (DDN) Business Unit is responsible for the development of advanced high-speed interconnect solutions used in hyperscale computing, AI systems, data centers, cloud infrastructure, and next-generation communication platforms.The team focuses on high-speed connectors, cable assemblies, and system-level interconnect solutions supporting cutting-edge protocols (e.g., PCIe, Ethernet, MSA, etc.), ensuring signal integrity, power integrity, and system performance.Role ObjectiveAs a Product Development Engineering Manager, you will lead a team responsible for research, design, and development of High Speed IO products aligned with customer requirements and future technology roadmap. You will drive innovation in high-speed signal transmission, ensuring robust product design, system performance, and successful product commercialization.Job Requirements• Lead team to research, develop, and sustain High Speed IO products across full lifecycle (concept to mass production)• Manage performance goals aligned with organization strategy; conduct regular reviews and feedback• Oversee end-to-end new product development (NPI) including design, simulation, validation, and release• Coach and develop team members to build a high-performance engineering organization• Drive continuous improvement of engineering tools, methodologies, and development processes• Define and execute High Speed IO technology roadmap aligned with industry trends and customer needs• Work closely with customers, sales, and PM to capture Voice of Customer (VOC), especially system-level SI requirements• Lead engineering execution following LEANPD/stage-gate processes, ensuring delivery on time, quality, and cost• Develop and maintain product documentation: specifications, SI reports, design guidelines, test plans, and validation reports• Collaborate with global manufacturing, procurement, and suppliers to meet technical, quality, and cost targets• Lead component and technology qualification, especially for high-speed materials and signal-critical structures• Ensure thorough design verification & validation, including SI/Thermal simulations, high-speed measurements (TDR, VNA, eye diagram, BER)• Partner with manufacturing teams to ensure smooth product ramp and yield optimization• Provide strong technical interface to customers on system integration, debugging, and performance optimization• Conduct competitive analysis and track industry trends in high-speed interconnect technologies• Build deep understanding of system-level applications (servers, switches, accelerators, etc.)• Drive innovation through collaboration with global teams and technology centers• Apply engineering best practices to optimize performance, cost, and manufacturabilityWhat your background should look likeEducation and KnowledgeTypically requires: Bachelor’s degree with 10+ years experience, ORMaster’s degree with 6+ years, ORPhD with 3+ yearsMinimum 3+ years leadership/people management experienceStrong background in electrical/mechanical engineering with emphasis on high-speed interconnect designDeep expertise in High Speed IO technologies, including: Signal Integrity (SI) and ThermalHigh-speed protocols (PCIe, Ethernet, MSA, CXL, etc.)Channel modeling and link budget analysisExperience with product development lifecycle (design, prototyping, testing, qualification)Familiarity with simulation and design tools: SI tools (e.g., HFSS)3D CAD and mechanical design toolsKnowledge of materials for high-speed applications (low-loss dielectric, plating, cable structures)Understanding of manufacturing processes (stamping, molding, plating, assembly, etc.)Experience with reliability, compliance, and high-speed test methodologies Familiarity with quality tools (FMEA, DOE, Six Sigma, 8D)CompetenciesSET : Strategy, Execution, Talent (for managers)ABOUT TE CONNECTIVITYTE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on LinkedIn, Facebook, WeChat,Instagram and X (formerly Twitter).COMPENSATION• Competitive base salary commensurate with experience: $164,900 – $247,400 (subject to change dependent on physical location)• Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.• Total Compensation = Base Salary + Incentive(s) + BenefitsBENEFITS• A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.EOE, Including Disability/VetsIMPORTANT NOTICE REGARDING RECRUITMENT FRAUDTE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.