Senior Staff Packaging Engineer
Cyfle
About the job Senior Staff Packaging Engineer We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. Please review the below description and let us know if you are interested. Prioritized Must Have Skills for the Senior Staff Packaging Engineer: #1. Minimum of 12 years experience in semiconductor packaging technology. #3. Organic laminate technologies manufacturing and supplier capabilities. Responsibilities of the Senior Staff Packaging Engineer: Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules Develop new assembly technologies, run process DOEs, to define process windows for new package development Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group Work closely with offshore assembly and substrate partners to develop new processes Work closely with IC design teams to define package design rules and define packages to meet their requirements Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products Requirements of the Senior Staff Packaging Engineer: BS Degree in Electrical Engineering, Mechanical Engineering, Material Science. Minimum experience 12 years in semiconductor packaging technology. Understanding of organic laminate technologies manufacturing and supplier capabilities. Experience in SMT or passive integrated package assembly is a plus. Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus) Experience with package substrate design rules, tools (including AutoCAD). Knowledge of AEQ Automotive reliability requirements. Knowledge of APQP automotive development process Knowledge of JEDEC/IPC design standards. Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus. Travel to Asia to attend technology reviews and resolve subcon/supplier issues Other Key Requirements: 100% in office Must be able to travel to Asia. No sponsorship or Visa holders. No Corp-to-Corp. Benefits of the Senior Staff Packaging Engineer: Medical Insurance Vision Insurance Short- & Long-Term Disability Insurance 401(k) Plan About the Company: Cyfle is a global business dedicated to connecting talents worldwide. Our comprehensive RPO services, placement services, and training services help businesses unlock their full potential. #J-18808-Ljbffr Cyfle
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