Packaging Equipment Engineer for Next-Gen Semiconductors
Intel
Intel Corporation in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop processes and equipment to improve efficiency, reliability, and quality across next‑generation packaging solutions.
Responsibilities include applying DOE and SPC, designing reusable test equipment, and ensuring manufacturability of layouts while driving continuous improvement in workflows and supplier collaboration. On‑site role in Phoenix.
#J-18808-LjbffrVacancy posted 2 days ago
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