Thermal Mechanical Engineer

Thermal Mechanical Engineer at PsiQuantum, Milpitas, California (remote). A mid-level full time position in the 4562 - Packaging Design team, listed under hardware engineering. Come join us. Job Summary The system engineering department is hiring a thermal mechanical engineer. You will be responsible for performing structural and thermal simulations to optimize the design of electro-optical sub-assemblies. Your work will directly impact on the performance and reliability of our quantum computer sub-systems. Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to View email address on click.appcast.io . Actual compensation may vary outside of these ranges and is dependent on various factors including, but not limited to, a candidate's qualifications, relevant education and training, competencies, experience, geographic location, business needs, and internal equity. Your recruiter can share more details about the salary range applicable to your location during the hiring process. Zone 1 - Bay Area and NYC Zone 2 - Examples include Los Angeles and Washington DC Zone 3 - Examples include Austin, Chicago, and Sacramento Zone 4 - Examples include Nashville and Phoenix/Tempe and many remote locations This position includes the following benefits: competitive health coverage for you and your dependents 401(k) with company match equity grants access to financial wellness tools and planning resources wellness benefits family support programs life and disability insurance paid leave programs company-designated paid holidays discretionary time off (DTO) an end-of-year company shutdown Some of these benefits have eligibility requirements and may vary based on location, role, or employment status. Many of these benefits are subsidized or fully paid for by the company. Responsibilities Develop detailed FEA/CFD models of components, packages, optical-electronic modules, and system-level assemblies using appropriate simulation tools such as ANSYS, COMSOL, or equivalent platforms. Correlate FEA results with experimental measurements, prototype test data, and hardware observations to improve model fidelity and support simulation-driven design decisions. Perform warpage and deformation analysis for multi-material assemblies, accounting for mismatch in thermal expansions, nonlinear material behavior, temperature gradients, and boundary conditions. Develop thermal cycling and mechanical fatigue models to predict long-term reliability, including creep, stress relaxation, and interface degradation. Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield. Analyze failures related to electro-optical assembly design and providing solutions. General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses. Develop end-to-end simulation workflows to automate processes, assess performance across diverse operating scenarios, documentation, and tools to improve efficiency, accuracy, and repeatability. Document and communicate results through clear technical reports, design reviews, and executive level summaries. Requirements M.Sc., or Ph.D in Mechanical Engineering, Electrical Engineering and Physics or related field. 5+years of hands-on modeling and simulation experience in the semiconductor industry. Strong understanding of thermal conduction and convective heat transfer methodologies. Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, constitutive models of elastic, visco-plastic, and plastic materials. Proficiency with simulation tools such as ANSYS (Mechanical, Icepak and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses. Working knowledge of lab-scale validation techniques. Experience with Ansys AEDT and Ansys Sherlock. Understanding advanced semiconductor packaging, solder joints, and reliability modeling techniques. Knowledge of common optical system specifications and optical component specifications. Exposure to SOC thermal mechanical analysis. #J-18808-Ljbffr Entangled Future