Foveros Direct Pathfinding Integration

Job Details:Job Description: Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology.Some of the responsibilities will include but not be limited to:You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities.Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel.Qualifications:Minimum QualificationsBachelor's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 6+ years of relevant experience; orMaster's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience; orPhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.Experience in packaging engineering, process development, and technology innovation.Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.Expertise in qualification testing, specification documentation, and packaging material certification.Preferred QualificationsExperience in advanced packaging technology development and strategic supplier management.Hybrid Bonding Process development or Integration experience.Experience with leading technology programs and engaging with cross-functional stakeholders.Experience participating in forums, task forces, or working groups driving defect reduction and process improvements.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, Arizona, PhoenixBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, Hillsboro; US, Arizona, PhoenixType: Full time