Physical Design Engineer
$100kTenstorrent
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are- A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts.
- Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration.
- Strong problem solver who excels at debugging complex issues across design hierarchies.
- Collaborative team player who thrives in fast-paced, technically challenging environments.
- BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs.
- Expertise with industry-standard tools (FusionCompiler, PrimeTime, RedHawk) and scripting languages (Tcl, Perl, Python).
- Deep understanding of advanced node challenges and low-power design techniques (power gating, multi-Vt, voltage scaling).
- Experience driving physical design requirements from early architecture through final signoff.
- How to implement cutting-edge AI accelerators, high-performance CPUs and the SOCs that host them on the most advanced process nodes.
- Innovative PPA optimization techniques and methodologies for next-generation chiplet architectures.
- End-to-end ownership from flow development to signoff in collaboration with architecture and IP teams.
- Direct impact on products that are redefining the landscape of AI and high-performance computing.
$2,000 per month
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