Boeing Engineering & Technology Innovation Graduate Researcher Program, Microelectronics R&D Intern

Job Description At Boeing, we innovate and collaborate to make the world a better place. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. Job Description At Boeing, we innovate and collaborate to make the world a better place. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. Graduate Researcher Program (GRP) Join our exclusive Graduate Researcher Program (GRP) in Engineering & Technology Innovation (E&TI) during the Summer of 2027 and you can build something better for yourself, for our customers and for the world. E&TI is Boeing's global research and development team developing and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators. Join us and put your passion, determination, and skill to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld What is Graduate Researcher Program? The GRP (Graduate Researcher Program) is a unique 10-12 week internship program designed specifically for students pursuing their PhD. GRP is a hybrid experience of real‑world industry work experience combined with development programming that exposes students to Boeing, its products, services and its people. GRP focuses on deeply connecting students to their team and Boeing through work experience across multiple summers with the goal of ultimately offering a full‑time position at the conclusion of academic studies if a mutual fit is achieved. How GRP Works GRP host teams post intern requisitions aligned with Boeing’s strategic needs, aiming to match their needs with top PhD talent. Once candidates apply and are selected, they receive an offer to spend the following summer working with their host team. The program is designed to give interns meaningful, hands‑on experience at Boeing, allowing them to apply their academic expertise while contributing to real‑world industry challenges and opportunities. In addition to industry work exposure, students attend GRP programming to further broaden their experience and knowledge of Boeing. GRP programming components include: mentorship in your field of study, weekly Featured Speaker Talks, a week‑long in‑person GRP Summit, participation in an Innovation Challenge, and other opportunities to interact and build a professional network with other GRP students, Boeing team members, and Boeing leadership. Please note: The work you do at Boeing can be related to your area of study, but cannot contribute or be used in your PhD thesis. Who we are looking for We are seeking students who will have completed their first year of study in their PhD program by July 2027 and are passionate about the aerospace industry and Boeing. GRP students excel at quickly adapting to their roles, analyzing complex problems, and developing innovative solutions. They thrive in collaborative team environments and possess excellent communication skills. Above all, they are driven to contribute to the success of their team, fellow GRP students, and Boeing. 2027 GRP Position Within E&TI, Boeing’s Microelectronics Technology organization performs microelectronics technology development, design, and test for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. Key Responsibilities will include: Conducting research and development in advanced microelectronics, focusing on design, verification, modeling, test, or analysis of digital, analog, mixed‑signal, or RF circuits, sub‑systems, and SoCs for high‑performance aerospace applications Applying expertise to emerging microelectronics challenges in AI, radar, EW, navigation, and secure communication systems Working collaboratively with senior Boeing engineers, researchers, and mentors to transition research concepts into viable technologies for Boeing programs Documenting findings, presenting results to technical leaders, and contributing to internal R&D knowledge bases This position is expected to be 100% onsite The selected candidate will be required to work onsite at one of the listed location options. This position requires the ability to obtain U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship An interim and/or final U.S. Secret Clearance Post‑Start is required. Job Related Information / Basic Qualifications: Completed the first year of PhD studies by July 2027 Ability to work full‑time for 10-12 weeks during Summer 2027 Pursuing a PhD in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline Coursework or research experience in one or more of the following: Digital logic design and verification, System‑on‑Chip architecture and integration, Semiconductor device physics, CMOS/BiCMOS fabrication and technology, Analog/mixed‑signal circuit design, RF/millimeter‑wave circuit design, Strong analytical, problem‑solving, and communication skills Preferred Qualifications: Experience with industry‑standard EDA tools (Cadence, Synopsys, Siemens EDA) Experience with microelectronics in extreme environments, to include high radiation environments, extreme temperatures, and long life/high reliability Experience conducting independent research, publishing results, or presenting at conferences Drug Free Workplace: Boeing is a Drug Free Workplace (DFW) where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies. Shift: This role is primarily first shift; however, there may be additional shift requirements to support program objectives. Relocation: This position offers relocation based on candidate eligibility. Pay and Total Rewards package At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities. The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements. Pay is based upon candidate experience and qualifications, as well as market and business considerations. Summary Pay Range: $90,000 Equal Opportunity Employer: Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law. Visa Sponsorship: Employer will not sponsor applicants for employment visa status. #J-18808-Ljbffr Boeing