Principal Intergration Engineer - MEMS

Job Description

Job Description

JOB SUMMARY:

· Contribute to the development/transfer, optimization, and documentation of the overall process flow and macro modules required to fabricate reliable, manufacturable MEMS (micro-electromechanical systems) and optoelectronics devices which meet parametric and performance goals.

· Characterize, evaluate, and document integrated semiconductor devices and reliability of circuit and process elements to ensure performance to quality standards.

 

DUTIES AND RESPONSIBILITIES:

1. Design and perform experiments and analyze the results to determine the process sequences and parameters which will yield the target device parameters, by using the results of the process simulations or initial test lots as a starting point.

2. Analyze data (electrical, in-process measurement or visual inspection) from the fabrication of test lots to determine which parameters require additional optimization.

3. Work with Process Engineering to develop, characterize, and optimize process modules.

4. Support the processing of the initial test chip and transfer lots fabricated with the new process to identify and correct any problem areas and work to achieve first-pass success.

5. Write the documentation required to permit the new process to be transferred to production.

6. Provide inputs to and work with Device Engineers to develop layout rules for the process being developed, using equipment specifications and experimental data.

7. Recommend test structures for and contribute to the layout of test chip mask sets to aid in developing the new process and evaluating specific process-dependencies of device parameters.

8. Create and maintain schedules for assigned projects to include mitigation plans where needed to ensure projects are completed on time.

9. Provide weekly, monthly, quarterly development updates to external customers.

10. Support company initiatives, such as; quality, safety and environmental management, CQI, 5S, yield management, and cost containment

11. Perform other duties as required.

Requirements

SKILLS AND KNOWLEDGE:

• Knowledge of semiconductor device physics and process integration
• Semiconductor fabrication processes
• MEMS fabrication with a focus on
• DRIE – etching
• VHF/BOE release – etch
• Front- and back-side processing

• Device characterization techniques
• Device layout design
• Device reliability testing

• Computer skills, including working knowledge of UNIX.
• Skills in DOE design, statistical data analysis, problem solving, writing, and communication.

Typically requires a minimum of Masters in Electrical Engineering, Materials Science, or Physics.

MS with 5-7yrs or PhD with 5+ years' experience preferred.

Benefits

• Health Care Plan (Medical, Dental & Vision)
• Retirement Plan (401k, IRA)
• Life Insurance (Basic, Voluntary & AD&D)
• Paid Time Off (Vacation, Sick & Public Holidays)
• Family Leave (Maternity, Paternity)
• Training & Development