Principal Packaging Engineer

Principal Packaging EngineerExperience Level: Professional Job Type: Regular Location: Greensboro, NC, US, 27409Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. The Greensboro Thermal Lab is seeking a highly motivated Packaging Thermal Engineer to lead infrared-microscope-based thermal characterization of Qorvo's RF product portfolio (open-face and overmolded devices). This engineer will own test methodology from setup through data interpretation, applying RF device physics and thermal management principles to correlate results with electrical/RF performance and package design. A key part of the role is building automation to improve throughput, repeatability, and reporting across the lab, along with communicating findings to design, applications, and quality engineering teams.DescriptionLead infrared microscope-based thermal characterization of RF power amplifiers, switches, and other packaged/overmolded devicesSet up and troubleshoot electrical/RF test conditions (bias, drive) using DC power supplies, RF signal generators, power meters/sensors, RF amplifiers, network analyzers, and arbitrary waveform generatorsDevelop test methodologies correlating thermal performance with RF operating conditions (Pin/Pout, efficiency, junction temperature)Build and maintain automation scripts (Python, MATLAB, LabVIEW, or similar) to control instrumentation and streamline data acquisition, analysis, and reportingAuthor engineering reports and present thermal findings/recommendations to design, applications, reliability, and quality engineering teamsGuide sample preparation, including board/fixture considerations and die milling/polishing for optical thermal accessEvaluate new thermal measurement equipment and techniques, and mentor technicians on test execution and data integrityQualificationsMaster's degree in Electrical Engineering, Physics, or related field8+ years of relevant experience or an equivalent amount of advanced education and experienceSolid understanding of RF device operation (power amplifiers, switches) and package-level thermal behavior (thermal resistance, heat spreading, die-attach effects)Demonstrated coding/scripting ability (Python, MATLAB, or equivalent) for instrument automation and data analysisHands-on experience with RF/lab equipment: DC power supplies, signal generators, power meters/sensors, amplifiers, network analyzers, signal analyzersStrong attention to detail, with clear written/verbal communication skills for cross-functional engineering collaborationMake a Difference at QorvoWe do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us. We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.Nearest Major Market: Greensboro