Firmware Engineer

Firmware Engineer

Teledyne FLIR is seeking an experienced Firmware Engineer to develop FPGA-based processing for next-generation infrared camera systems. This role focuses on implementing advanced video-processing algorithms, developing new camera-control features, and supporting high-speed infrared sensor interfaces. The ideal candidate brings strong digital hardware expertise, hands-on debugging skills, and familiarity with modern microprocessor, memory, FPGA, and interface technologies.

This position is based in Goleta, California.

Must be US Citizen or PERM Resident

Key Responsibilities

• Design, develop, and test FPGA-based firmware and digital hardware for infrared camera systems.
• Implement new video-signal-processing algorithms and camera-control features within FPGA architectures.
• Support integration of high-speed infrared sensor interfaces.
• Collaborate closely with Systems, Mechanical, Software, Firmware, and Video Processing teams to refine requirements and ensure seamless system integration.
• Create block diagrams, parts lists, and design review documentation for complex electronic systems.
• Perform hands-on testing using logic analyzers, oscilloscopes, signal generators, and FPGA debug tools.
• Support system-level troubleshooting, product integration, and design validation throughout the development lifecycle.
• Contribute to a fast-paced, dynamic engineering environment focused on innovation and high-performance imaging solutions.

Required Skills, Experience & Education

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related technical field OR equivalent applicable experience.
• Minimum 5 years of experience in digital hardware design and testing.
• Strong background with microprocessors, FPGAs, high-speed interfaces, DDR/flash memory, and complex electronic system design.
• Proficiency in Verilog or VHDL for FPGA implementation and verification.
• Hands-on experience with logic analyzers, high-speed oscilloscopes, signal generators, and FPGA debugging tools.
• Ability to thrive in a fast-moving product development environment.
• Excellent verbal and written communication skills and strong collaboration abilities.

Preferred Qualifications

• Experience with Xilinx, Intel/Altera, Lattice, or Microchip FPGA families.
• Experience writing embedded drivers for I2C, SPI, display interfaces, UART, USB, or Bluetooth.
• Background in image-processing pipelines for camera systems.
• Experience with ISO 26262 automotive safety compliance.
• Signal-processing experience.
• Familiarity with ModelSim, MATLAB, or Simulink.

Salary Range: $113,600.00-$151,400.000

Pay Transparency

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.