Principal IC Package Design Engineer (SI/PI)

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Ciena Corporation invites applications for an SI/PI Design Engineer to lead the electrical package design for custom in-house photonic, analog, and digital ICs powering next‑generation optical modules.

You will own advanced package selection, BGA configurations and package structures, and oversee layout, verification, and tapeout. Collaboration across teams will optimize silicon floor plans and interposers, with SIWave/HFSS-based simulations guiding decisions.

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Vacancy posted 6 hours ago

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