Package Design Engineer
$163k - $237kDevelop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.Define and document the requirements for the package substrate design and bill of materials (BOM).Minimum qualifications:Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.Experience in chip package substrate layout, design verification, DFM and taping out for production.Experience in design automation and scripting.Preferred qualifications:Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.Experience in working with cross functional teams including chip design, SI/PI, and PCB design teams.Experience in 2.5D/3.5D advanced package design.Experience in physical verification flow (LVS, DRC, connectivity).Experience with CAD for creating simple mechanical drawings, such as package outline drawings (POD).Ability to write scripts to customize elements of the Cadence or Mentor workflow.Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.As a Chip Package Designer on the Silicon Integration team, your role is to develop package substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves collaborating with SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create complex, high-performance substrate designs, where your goal is to optimize package substrate design for electrical performance, reliability, and assembly.You will manage all phases of the design process, including routing feasibility, test vehicle creation, product designs, conducting design reviews, artwork export, DFM process and generating final documentation. Additionally, you will be instrumental in identifying and incorporating advanced chip packaging technologies into the Google chip product design pipeline, which contributes to successful chip deployment in data centers, ensuring the best optimized PPA (Power, Performance, Area) designs and enhancing system performance relative to TCO (Total Cost of Ownership) and power.The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving team behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $163000 - $237000 (USD) + 15% bonus target + equity + benefitsLearn more about benefits at Google.Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.Experience in chip package substrate layout, design verification, DFM and taping out for production.Experience in design automation and scripting.
$136k - $218.5k
...work. Come join the team and see how you can make a lasting impact on the world.NVIDIA's Advanced Package Engineering team sits at the intersection of cutting-edge chip design and the physical reality of getting silicon to product — and we're expanding it. As AI systems...SuggestedFull time- ...delivered for millions of patients worldwide.We’re a team of engineers, clinicians, and innovators united by one purpose: to make... ...Job DescriptionPrimary Function of PositionThe Medical Device Packaging Design Engineer is a critical engineering role responsible for the...SuggestedFor subcontractorLocal areaWorldwideFlexible hours
$159k - $230k
...CAD models, and 2D technical drawings for packaging systems and components.Identify and... ...assembly throughput.Coordinate packaging design with Product, Manufacturing, Quality, and... ...qualifications:Bachelor's degree in Mechanical Engineering, Product Design, a related field, or...Suggested- ...high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating... ...Computing Group is seeking an experienced and self-motivated package design engineer. As a key member of the Package group, you will work across...Suggested
$152.5k - $219.2k
.... Because full product development—from design to qualification to production—is within... ...contribute to the development of complex ASIC package designs from early planning and... ...industry within a highly collaborative engineering environment.Responsibilities:• Contribute...SuggestedFull timeTemporary workLocal areaFlexible hours$200k - $240k
...Principal Package Design Engineer Job Description Principal Package Design Engineer Location: Hybrid at main Renesas Electronics America locations (San Jose, CA / Austin, TX) Department: Semiconductor Power Product Group Reports To: Senior Principal, Device...Work at officeRemote work$2,000 per month
...hardware for frontier intelligence. We co-design chips, racks, software, and... ...top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure... .... Job Summary As a Substrate IC Package Layout Design Engineer you will be responsible...Work at officeRelocation package- A leading recruitment firm is looking for a Package Design Engineer to take responsibility for complex flip-chip-BGA package designs in a collaborative environment focusing on high-speed SerDes, AI, and HPC applications. The ideal candidate will have significant experience...Full time
- Executive Recruiter and Account Manager for Semiconductors, Defense, and AI Our client is seeking an experienced Package Design Engineer for complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and RF/microwave communications A/D D/A converters...Full timeWorldwide
$120k - $275k
...to systems including hardware and software to train and run the largest ML workloads for AGI. MatX is seeking a Silicon Design-For-Test (DFT) engineer to join our team as we create best-in-class silicon for high-performance and sustainable GenAI. The successful...Full timeWork experience placementLocal areaRemote workMonday to FridayFlexible hours$168k - $264.5k
We are now looking for a motivated Senior Circuit Design Engineer to join our dynamic and growing Power Circuits Solutions Group. If you are... ...with other System/Software Architects, Power Integrity /Packaging experts and Product and Process engineers to understand product...Full time- ...beyond. Together, we advance your career. THE ROLE: As a Power Engineer in Networking Technology & Solutions Group, you will be... ...and efficiency. You will be responsible for the innovation and design of board-level DC-DC power conversion and input protection. This...
$168k - $258.75k
The Senior Datacenter Power Design and Modeling Engineer leads cross-functional execution and modeling for data-center power-delivery programs. This role owns rack-level architecture definition and involvement, end to end power modeling and simulation for advanced Datacenter...Full time$136k - $218.5k
The SCG Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges architecture, silicon, and platform — translating product noise targets into shipped...Full timeLive in$168k - $264.5k
...of modern AI, positioning NVIDIA as a leader in this next wave of computing.We are now looking for a motivated Senior Circuit Design Engineer in Power Modeling and Simulation to join our dynamic and growing Circuits Solutions Group. If you are looking for a significant...Full time$168k - $264.5k
...looking for a highly motivated and self-starting Senior Circuit Design Engineer to join our dynamic and growing team. If you are interested... ...highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your...Full time$133.5k - $183.5k
...Materials is a global leader in materials engineering solutions used to produce virtually... ...chip and advanced display in the world. We design, build and service cutting-edge equipment... ...in the establishment and management of packaging suppliers and related processes and procedures...Full time$136k - $212.75k
...To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through... ...will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed...Full timeRemote work$90 - $110 per hour
Pride Global is seeking a Contract Product Design FEA Engineer in Cupertino, CA, to support the structural design and validation of consumer technology products. The ideal candidate will have a Master's degree in Mechanical Engineering, 3+ years of FEA experience, and hands...Contract work$136k - $218.5k
...clocks group is looking for a top-notch ASIC engineer to join the team. The Team is responsible... .... The team collaborates with the front design team to understand the clocking... ...competitive salaries and a generous benefits package, we are widely considered to be one of the...Full timeWork experience placement$163k - $237k
Engage in developing CPU cache subsystems, focusing on RTL design and microarchitecture for future CPU generations.Collaborate with... ...and area.Minimum qualifications:Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or...Worldwide$163k - $236k
...separately to create and review management and control subsystem's design microarchitecture specifications.Develop SystemVerilog RTL to... ....Minimum qualifications:Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or...Worldwide$141.91k - $200.34k
...Intel's HIPD team is looking for an experienced senior Logic design engineer to join the rapidly growing UCIE PHY IP for Intel's flagship... ...ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeWork experience placementInternshipLocal areaImmediate startShift work$119.8k - $234.7k
...Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s... ...reality. We are looking for a Sr. Design Engineer - IP Office to work in the dynamic... ...PD), Design for Test (DFT), Validation, Packaging and Board Design teams to optimize design...Ongoing contractPermanent employmentWork at officeLocal area3 days per week$100k
...contributors of all seniorities.As a Senior Chiplet Physical Design Engineer at Tenstorrent, you will work on a high-profile, cutting-edge... ...designing and integrating multiple chiplets into a System-in-Package (SiP). You’ll collaborate closely with Tenstorrent experts and...Permanent employment$120k - $250k
What MatX Is BuildingMatX is seeking engineers with strong Haskell skills to join our team as we create best-in-class silicon for high-performance... ...'s type system and semantics. If you've ever wished you could design hardware with the composability and correctness guarantees of a...Full timeWork experience placementLocal areaRemote workMonday to FridayFlexible hours$164.47k - $311.89k
Job Details:Job Description: As a Physical Design Timing Engineer, you will play a pivotal role in shaping the performance, power efficiency,... ....Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive...Full timeInternshipLocal areaImmediate startShift work$136k - $218.5k
...world.We are now looking for a motivated Senior Physical Design and Timing Engineer to join our dynamic and growing team. If you want to challenge... ...highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and...Full time$164.47k - $269.1k
...better brings. We work every single day to design and manufacture silicon products that... ...OverviewWe are seeking a senior physical design engineer who is passionate about driving... ...solutions spanning chiplet and advanced packaging technologies. In this hands-on role, you...Full timeInternshipLocal areaImmediate startShift work$174k - $252k
...Partner with model researchers, software and hardware teams to co-design architectural improvements tailored to Large Language Model (... ...:Bachelor’s degree in Computer Science, Electrical Engineering, Computer Engineering, a related field, or equivalent practical...Worldwide
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