Packaging Assembly Engineer

San Francisco Bay Area, California, United States Hardware Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Description Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel. Responsibilities Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection). Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams. Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings. Lead root‑cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams. Partner with substrate and package design teams to provide DFM input on pad/bump design, stack‑up, warpage control, and assembly design rules for FCBGA packages. Support NPI builds and ramp at OSAT sites: process window definition, buy‑off criteria, and transfer to volume manufacturing. Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets. Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly. Minimum Qualifications BS and 10+ years of experience in relevant industry experience or equivalent Preferred Qualifications M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired. 5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc. Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers. Ability to work independently and take on projects with minimum supervision. Good engineering problem solving skills with strong engineering physics and fundamentals. Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant. Apple accepts applications to this posting on an ongoing basis. #J-18808-Ljbffr