Process Integration Engineer (Reader)

TITLE: PROCESS INTEGRATION ENGINEER (READER)FLSA STATUS: EXEMPTREPORTS TO: MANAGER, READER INTEGRATIONSUMMARY:Under the direction of the Manager of Reader Integration, the Process Integration Engineer (Reader) is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on newly developed processes, and recommending corrective action. This position is located in Milpitas, California.ESSENTIAL FUNCTIONS:Develops and delivers process integration and characterization techniques for new technology programs and next generation productsDesign and conduct experiments to verify process robustness; analyzes data, reports findings, and perform FMEA to meet the product requirements.Conducts failure analysis on newly developed processes and recommends corrective action.Participates in characterization or integration projects of various scopes and complexity; ensures they are completed within the established timeframeConducts wafer level probing data analysis, failure analysis and yield improvement to ensure the final yield meets customer requirementsPerforms wafer level process characterization on thin film recording heads via Focused Ion Beam (FIB) tool and CD-SEM to identify defects and recommends corrective actionReviews and analyzes backend performance data and makes recommendations to improve performanceDrives improvements to the characterization process which improve production yields via process/tool manufacturability optimizationAnalyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teamsResponds to inquiries from other team members, managers, or departmentsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*MINIMUM QUALIFICATIONS:Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferredThree years of hands-on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering roleHands on experience using JMP or similar analytical applicationProficient in the use of Microsoft Office ApplicationsRequired Knowledge, Skills, and Abilities:Knowledge of process integration and characterization principles, practices, and techniquesKnowledge of magnetic recording head or HDD manufacturingKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsAbility to design experiments, analyze results, and recommend corrective actionCommunicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAbility to work productively and collaboratively with all levels of employees and managementAbility to comply with all safety policies and proceduresAbility to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvementsDemonstrated analytical skillsDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritizeThe annual rate for this full-time position is between $121,000.00-$160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.WORKING CONDITIONS:The Process Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department. #J-18808-Ljbffr Headway Technologies Inc