Staff Equipment Development Engineer - Advanced Packaging

Position Overview As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next‑generation, first‑of‑a‑kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment‑related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost‑reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing. Responsibilities Develop strategies and implement improvements to enhance equipment maturity for FOAK hardware. Develop 5+ year hardware roadmaps for post‑probe wafer and die processing, including wafer and assembly equipment that meets physical and electrical requirements of Micron’s products. Optimize equipment to reduce cost, increase availability, and improve hardware and process capability. Collaborate with process development teams to create innovative new solutions. Conduct root‑cause and failure‑mode analysis to understand current hardware limitations and drive APTD development projects with OEM vendors for solutions. Perform fundamental research to drive innovative solutions for next‑generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Minimum Qualifications Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical fields. 2+ years of semiconductor process or equipment engineering experience. Fundamental understanding of post‑probe and assembly process and equipment interactions. Understanding of related inline/electrical/probe failure. 2+ years of experience with design‑of‑experiment techniques (DOE), Statistical Process Control (SPC), defect analysis, and data analysis. Ability to resolve sophisticated issues through root‑cause or model‑based problem‑solving and focus on meeting commitments. Hands‑on experience with wafer/assembly tools and overlay systems. Preferred Qualifications Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience. Knowledge of robotics, machine‑logic language, or new hardware design is desirable. Experience in wafer or die bonding, plating, warpage control, and packaging field is preferable. Benefits Micron provides a range of medical, dental, and vision plans to accommodate individual and family healthcare needs and budgets. Additional programs include income protection for illness or injury, paid family leave, an extensive paid time‑off program, and paid holidays. Detailed information is available in Micron's Benefits Guide. Equal Employment Opportunity Micron is a proud equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology