Manufacturing Technician - Wire Bonding (Manual Wedge)

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: Microchip company, Discrete and Integrated Solutions Group (DISG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DISG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discreet BU. Markets the PDM & RF/MW discrete BU's address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors and security. Microchip is planning to fill the following position with a talented, creative and motivated individual. We are seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards. Job Responsibilities: Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools. Inspect and test wire bonds to ensure quality and compliance with specifications. Perform wire bond equipment setup including tool changes, wire changes, and troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime. Maintain accurate records of production data, process adjustments, and equipment maintenance. Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality. Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment. Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge. Assist in the training of new technicians and support staff as required. Perform other tasks and assist with various projects as needed. Requirements/Qualifications: High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred. Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role. Proficiency with automated wire bonding machinery and manual wire bonding techniques. Strong understanding of microelectronics and the ability to work with delicate components. Ability to read and interpret technical drawings and process specifications. Ability to navigate and utilize a computer to perform job activities. Excellent manual dexterity and hand-eye coordination Excellent visual capability to work with extremely small die, without magnification devices. Experience using tweezers, vacuum pencils, etc. Strong problem-solving skills and attention to detail. Ability to work in a fast-paced, team-oriented environment. Good communication skills, both written and verbal. U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3). Travel Time: No Travel Physical Attributes: Carrying Climbing Crouching Feeling Foot Controls Handling Hearing Kneeling Lifting Noise and/or vibration Other Pulling Pushing Reaching Seeing Stooping Talking Works Alone Works Around Others Physical #J-18808-Ljbffr Microchip Technology