Packaging Engineering Intern — Semiconductors & Innovation
Texas Instruments
Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies across multiple product lines. You will collaborate with cross-functional teams to drive solutions for Wirebond, Flip Chip, Modules and SIPs, supporting advancements in miniaturization, reliability and performance. The internship requires enrollment in a Masters program in engineering, a 3.0 GPA or higher, and Foundations in heat transfer, stress analysis, and #J-18808-Ljbffr Texas Instruments
Vacancy posted 1 day ago
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Texas Instruments
Dallas, TX2 days ago
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