SMT Engineer

HR On Demand (HROD) is a Texas-based, full-service HR partner helping global companies establish and grow their U.S. operations. We provide end-to-end HR solutions — from talent acquisition and payroll to compliance, employee relations, and organizational development. Backed by Fortune 500 HR leadership experience, we help businesses build compliant, high-performing teams and navigate the complexities of the U.S. market with confidence. We're posting this role on behalf of our client, a leader in robotics and intelligent optical systems. Role Overview The SMT Engineer will own and optimize surface mount technology (SMT) processes for PCB assembly, ensuring high-quality, high-yield production of transceiver module circuit boards. This role covers process setup, equipment programming, troubleshooting, and continuous improvement across the SMT line. Key Responsibilities Set up, program, and optimize SMT equipment (printers, pick-and-place, reflow ovens, AOI/SPI systems) for new and existing product builds Develop and maintain SMT process parameters (stencil design, reflow profiles, placement programs) to meet quality and yield targets Troubleshoot line issues (solder defects, placement errors, component misalignment) and drive root cause corrective actions Support new product introduction (NPI) by developing process flows and validating first-article builds Monitor SMT yield, first-pass rate, and defect metrics; lead continuous improvement initiatives (SPC, DOE, Lean/Six Sigma) Partner with quality engineering on failure analysis, IPC-A-610 standards compliance, and customer escalations Coordinate with equipment/facilities teams on preventive maintenance and equipment qualification Train and support SMT operators/technicians on process standards and best practices Required Qualifications Bachelor's in Electrical Engineering, Manufacturing Engineering, or related field (or equivalent experience) 3+ years of SMT process engineering experience in electronics manufacturing Hands-on experience with SMT equipment (pick-and-place, reflow, AOI/SPI) and process optimization Working knowledge of IPC standards (IPC-A-610, J-STD-001) Familiarity with SPC, DOE, and Lean/Six Sigma methodologies Strong troubleshooting and root cause analysis skills Preferred Qualifications Experience with high-speed/high-density PCB assembly (e.g., transceiver, optics, or RF modules) Experience supporting new facility start-up or production line ramp-up Mandarin proficiency (collaboration with Taiwan-based teams) Job Type: Full-time 401(k) Health insurance Paid time off Experience: Surface mount technology: 2 years (Required) #J-18808-Ljbffr HR on Demand