Staff Equipment Development Engineer - Advanced Packaging

Position Overview As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing. Responsibilities Develop strategies and implement to improve Equipment maturity for (FOAK) hardware. Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability. Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Minimum Qualifications Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 2+ years of semiconductor process or equipment engineering experience Fundamental understanding of post probe and assembly process and equipment interactions. Understanding of related inline/electrical/probe failure. 2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Ability to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitments Hands on experience with wafer / assembly tools and overlay systems Preferred Qualifications Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience Knowledge of robotics, machine logic language, or new hardware design is desirable. Wafer or die bonding, plating, warpage control and packaging field experience preferable. Benefits As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. EEO Statement Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc