Senior Packaging Architect — 3D Photonics for AI HPC (Hybrid)
Lightmatter
Lightmatter is transforming AI data center infrastructure with a focus on advanced packaging. As a Packaging Architect, you will own packaging solutions from concept to release, collaborating with chip designers, system architects, and cross-functional teams to balance performance, cost, and manufacturability across the full product lifecycle. You will define electrical, thermal, and mechanical specs, drive architecture trade-offs, and ensure alignment with project budgets and schedules, while #J-18808-Ljbffr Lightmatter
Vacancy posted 5 days ago
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