Principal Signal Power Integrity /HW Design Architect

Responsibilities MaxLinear is seeking a Principal Signal Power Integrity/HW Design Architect to join out team.We have a culture that thrives on innovation and allows you to learn, teach and grow while contributing to the success of our products and company. In this role, you will focus on: Responsible for design and simulation of state-of-the-art packages and boards for advanced communications SoCs as well as high-speed products Work cross-functionally with IC designers, Layout engineers, board designers, thermal engineers and test/characterization team to plan and architect the power delivery and Signal integrity needs of packages and PCBs for MaxLinear’s next generation products You will work on a diverse set of applications ranging from Wireless/RF, 5G communications, power amplifiers, wired optical communications for 400G/800G involving NRZ, PAM4 and storage market, targeted for Datacenters, AI, and machine learning Qualifications Experience in HW design and must have hands-on experience in designing Rf/High speed PCBs Experience designing and simulating signal and power integrity solutions for high speed system components (packages, PCB, connectors etc…) Strong understanding of Electromagnetic fundamentals and transmission line theory Be able to navigate in layout tools such as Allegro and APD used for PCB and Package design and be able to update the design for minor changes and optimizations High speed channel simulations for SerDes and transient simulation for SI and PI Detailed understanding of s-parameters, Smith Chart and frequency domain analysis Strong working knowledge of HFSS, SiWave, PowerSI or similar field solvers for generating electrical models from package and PCB layouts Self-motivated, excellent communication skills, and ability to excel in a fast-paced environment Understanding of different IEEE and Optical standards to define design guidelines Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs or optical drivers. Multi-chip package design Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs Hands-on experience with Oscilloscope, Spectrum Analyzer, and VNA Expertise in HSPICE, SPECTRE and ADS and be able to run time and frequency domain simulations for PDN analysis; use AMI models for channel simulations Masters or PhD in Electrical Engineering with at least 8+ years of SI/PI experience Company Overview MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications. We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the world’s most challenging communication technology problems in the most efficient and effective manner. MaxLinear began by developing the world’s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn’t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, we’ve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, we’ve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intel’s Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers’ needs. Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Valencia, Spain; Bangalore, India; Munich, Germany; Israel; and Singapore. We have approximately 1,200 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market. #J-18808-Ljbffr