CMP Module Process Engineer IV - (E4)

What We Offer Salary: $116,000.00 - $159,500.00 Location: Boise, ID, Hillsboro, OR You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Role Responsibilities Must be a technical expert with 10+ years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background. Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems. Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's. Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization. Identifies opportunities for CSA renewal /upsell /penetration. Demonstrates & drives the adoption of new service technologies including FabVantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs. Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic FabVantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can issue the report and present to customer which includes explaining the priority and providing the suggestion based on the compare BOM, EC, FSS data and FV360 for two products. Mentor/Lead junior level MPE's. Advanced integration knowledge. Domain knowledge of 3 or more types of CMP processes and familiarity with Applied equipment. Lead and contribute to CMP network of experts and Community of Practice. Qualifications BS - Engineering 10+ years of experience in Chemical Mechanical Planarization (CMP) Process Wafer Fab Process / Equipment experience Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view. Regarded as the technical expert in CMP Unit Process and Wafer Fab operations. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 25% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e‑mail at View email address on click.appcast.io, or by calling our HR Direct Help Line at View phone number on click.appcast.io, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications. #J-18808-Ljbffr Applied Materials