Laser Packaging Development Engineer - DOE & SPC
Intel Corporation
Intel Corporation in Arizona seeks a Packaging Module Development Engineer in Laser Assembly to shape the future of semiconductor packaging technologies. You will contribute to development of processes and equipment that ensure high performance and reliability across Intel's assembly and packaging solutions. Collaborate with cross-functional teams to design laser assembly packaging processes, optimize manufacturing, set DOE-based specs, and drive standardization in qualification and quality #J-18808-Ljbffr Intel Corporation
Vacancy posted 12 hours ago
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