Senior Product Development Engineer

Scope:

Drive end-to-end development and integration of MicroLED AR display modules, connecting the MicroLED display chip, CMOS backplane, package, driver electronics, and optical engine. Translate product requirements into module-level specifications and validation plans; coordinate internal teams and external partners; troubleshoot system-level issues; and deliver characterized prototypes for customer evaluation and product commercialization.
Key Responsibilities:

Lead end-to-end integration of MicroLED display chips, CMOS backplanes, package structures, driver boards, and optical engine components.
Translate customer and application needs into module-level requirements, interface definitions, development plans, and measurable performance targets.
Coordinate display, CMOS, packaging, hardware, firmware, optics, test, and manufacturing contributors to resolve cross-subsystem issues.
Bring up and debug display modules, including power delivery, electrical interfaces, timing, grayscale control, pixel behavior, image artifacts, and communication interfaces.
Work with packaging teams and external suppliers on die/backplane integration, bonding and interconnects, assembly builds, alignment, and packaging-related failure analysis.
Integrate MicroLED modules with optical components such as collimation optics, micro-optics, and AR waveguides, as applicable to the product.
Plan and execute electrical and optical characterization covering luminance, wavelength, color, uniformity, grayscale response, optical efficiency, and power consumption.
Analyze engineering data, perform root-cause investigations and design-of-experiments where appropriate, and drive corrective actions and design iterations.
Define module validation procedures, acceptance criteria, and technical documentation; support prototype delivery, customer evaluation, reliability assessment, and manufacturing readiness.
Qualifications & Experience:

The role requires broad product-level integration experience across optoelectronics, display electronics, semiconductor packaging, and optical systems. The engineer must be comfortable debugging hardware and working across disciplines, rather than owning only one subsystem.
Required:

Bachelor's degree in Electrical Engineering, Optical Engineering, Applied Physics, Materials Science, or a related technical field.
At least 5 years of relevant experience in display module development, optoelectronic product development, semiconductor integration, or electronic hardware development.
Hands-on experience integrating multiple hardware, semiconductors, or optoelectronic components into a functioning product or module.
Experience with hardware bring-up, system debugging, performance characterization, and structured root-cause analysis.
Ability to interpret engineering data, document technical findings, and coordinate resolution of issues across multiple engineering disciplines.
Strong written and verbal communication skills and ability to manage multiple technical tasks in a fast-paced environment.
Preferred:

Direct experience with MicroLED, LED, OLED, LCOS, or other microdisplay technologies.
Experience with AR display modules, near-eye displays, optical engines, waveguides, or precision optical alignment.
Familiarity with CMOS display backplanes, display driver ICs, pixel-driving architectures, and interfaces such as MIPI, SPI, or I²C.
Experience with advanced semiconductor packaging, die bonding, wafer-level packaging, or fine-pitch hybrid bonding.
Experience with driver boards, embedded hardware, display control firmware, and power-delivery considerations.
Hands-on use of optical or electrical characterization equipment, spectrometers, imaging systems, or automated data-acquisition tools.
Proficiency in Python, MATLAB, LabVIEW, or similar tools for engineering data analysis.
Experience with product validation, reliability evaluation, yield improvement, design for manufacturability, or external suppliers.
Skills & Competencies:

System integration: Understand interfaces and interactions among MicroLED devices, CMOS backplanes, packages, driver electronics, and optical subsystems.
Troubleshooting: Isolate electrical, optical, mechanical, packaging, and firmware-related issues using a structured, data-driven approach.
Analytical thinking: Correlate measured results with design and process variables; draw clear conclusions and recommend the next practical steps.
Execution and ownership: Drive open issues to closure, manage competing priorities, and deliver prototypes and documentation on schedule.
Collaboration: Communicate effectively with cross-functional teams, external suppliers, and engineering partners; make technical trade-offs clear.
Attention to detail: Maintain accurate test records, interface specifications, build history, and validation results.
Equal Employment Opportunity

Inlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.

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