R&D Scientist - High Performance Computing Materials

Job SummaryWe are seeking an accomplished R&D Scientist to lead Avient's innovation in next-generation thermoplastic materials for High Performance Computing (HPC), AI infrastructure, and hyperscale data center applications.This technical leader will develop advanced low dielectric constant and ultra-low dielectric loss materials for high-speed connector systems operating at increasingly demanding data rates. The successful candidate will combine expertise in materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization of breakthrough materials for next-generation computing architectures.The ideal candidate will have deep knowledge of the relationship among material structure, processing, characterization of electrical performance for complex form-factors, with experience supporting high-speed connectors, semiconductor packaging, advanced interconnects, data communications, RF systems, or other signal integrity-critical technologies.As part of Avient's Corporate Technology Innovation organization, this role will influence technology strategy, intellectual property development, customer engagement, and future growth platforms at the forefront of AI and digital infrastructure.Our purpose at Avient Corporation is to be an innovator of materials solutions that help our customers succeed, while enabling a sustainable world.Innovation goes far beyond materials science; it’s powered by the passion, creativity, and diverse expertise of 9,000 professionals worldwide. Whether you’re a finance wizard, a tech enthusiast, an operational powerhouse, an HR changemaker, or a trailblazer in materials development, you’ll find your place at Avient.Join our global team and help shape the future with sustainable solutions that transform possibilities into realities. Your unique perspective could be the key to our next breakthrough!We believe that all of our global employees are leaders and that the six most important behaviors for driving our strategy and culture are the same no matter if an employee is a leader of self, a leader of others, or a leader of the business.By playing to win, acting customer centric, driving innovation and profitable growth, collaborating seamlessly across Avient, and motivating and inspiring and developing others and yourself you will accelerate your ability to achieve Avient’s strategic goals, to meet our customer needs, and to accomplish your career goals.At Avient, we believe a wide variety of thoughts, ideas and backgrounds gives us the creativity to be successful in a rapidly changing world. In support of this, we stress equality of opportunity for all qualified individuals in accordance with applicable laws. Decisions on hiring, promotion, development, compensation or advancement are based solely on a person’s qualifications, abilities, experience and performance.Avient is an equal opportunity employer. We maintain a policy of non-discrimination in providing equal employment to all qualified employees and candidates regardless of race, sex, sexual orientation, gender identity, age, color, religion, national origin, disability, genetic information, protected veteran’s status, or other legally protected classification in accordance with applicable federal, state and local law. If you need an accommodation because of a disability to complete an online application, please contact the Avient HR Team by emailing, View email address on click.appcast.io & ExperienceMinimum QualificationsPh.D. in Materials Science & Engineering, Polymer Science, Physics, Electrical Engineering, Chemical Engineering, or a closely related field.At least 5 years of industrial or advanced research experience developing materials for electronics, semiconductors, communications, or high-performance computing applications.Preferred Qualifications10+ years of experience in advanced materials development and commercialization.Demonstrated expertise in high-speed connectors, interconnects, semiconductor packaging, RF, microwave, or signal integrity applications.Proven record of patents, technical publications, and successful commercialization of new technologies.Experience collaborating directly with customers and external technology partners.#CA-ALEssential FunctionsTechnical Leadership & InnovationLead development of next-generation thermoplastic materials for high-speed connector and interconnect applications in AI, cloud computing, networking, and hyperscale data centers.Serve as the company's technical subject matter expert in dielectric materials, signal integrity, and material solutions for high-frequency electronics.Develop material platforms with industry-leading dielectric constant (Dk), dissipation factor (Df), dimensional stability, thermal performance, processability, and reliability.Identify emerging technology trends and establish roadmaps aligned with industry requirements for 224G, 448G, and next-generation data transmission architectures.Expand Avient's intellectual property portfolio through invention disclosures, patents, and new technology platforms.Materials DevelopmentDesign and optimize thermoplastic formulations based on structure-property-performance relationships.Evaluate high-performance polymers, including LCP, PPE, PPS, PEEK, fluoropolymers, polyimides, and other advanced dielectric materials.Investigate novel fillers, reinforcements, additives, and processing methods to achieve ultra-low dielectric loss.Establish material selection criteria and specifications that meet customer requirements for signal integrity, thermal management, reliability, and manufacturability.Use advanced statistical methods, design of experiments (DOE), and data analytics to accelerate formulation optimization.Characterization & TestingDevelop and execute advanced methods to characterize electrical, thermal, mechanical, and morphological properties.Correlate molecular structure, morphology, crystallinity, and interfacial interactions with high-frequency dielectric performance.Lead testing and analysis using techniques such as:Vector Network Analysis (VNA)Dielectric spectroscopyTime-domain reflectometry (TDR)Differential scanning calorimetry (DSC)Dynamic mechanical analysis (DMA)Thermogravimetric analysis (TGA)Microscopy and surface characterization techniquesInterpret material- and device-level performance data to guide formulation and design decisions.Customer & Market EngagementPartner with marketing and commercial teams to capture the voice of customers, including connector manufacturers, semiconductor suppliers, hyperscale data center operators, and OEMs, and understand future material requirements.Translate emerging computing and networking trends into actionable material innovation opportunities.Provide technical leadership in customer interactions and development programs.Present technical findings to customers, industry organizations, and executive leadership.Cross-Functional CollaborationPartner with manufacturing, engineering, quality, procurement, and commercial teams to scale technologies from concept through commercialization.Support pilot- and production-scale implementation of new material technologies.Lead multidisciplinary project teams and external research collaborations with universities, national laboratories, suppliers, and industry consortia.Full timePosting Date: 2026-09-29