Senior Design Release Engineer

Job Description

DUTIES: Supports the design, development, verification, documentation, and definition of our next generation System-on-Chip (SoC) semiconductors. Supports and drives discussion on SoC needs, architecture and use cases with our vehicle architecture teams working on our Software Defined Vehicle (SDV) Architecture. Builds partnerships and work closely with functional peers across semiconductor and ECU engineering, purchasing, and SoC suppliers to implement semiconductor strategic objectives. Develops eSOR (Statement of Requirements) and releases SoC semiconductors to facilitate on-time sourcing and integration with ECUs in accordance with Global Vehicle Development Process and program timing requirements. Runs Product Development Team (PDT) consisting of all internal and external partners ensuring semiconductors are designed, produced and production ready. Builds strong semiconductor fabrication partner relationships ensuring clear understanding of manufacturing process, supply chain business arrangements. Project manages ongoing process and product design changes related to semiconductors within scope of responsibility and present progress to leadership. Establishes domain expertise for semiconductors product line within scope of responsibility. Hybrid Work Policy – 3 days In-Office, 2 Days Remote – Must be able to report to local office.

REQUIREMENTS: Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Science, or related field of study and Five (5) years of experience as a Design Release Engineer, Electrical Engineer, Vehicle Computing Engineer, or related role. OR Master’s degree in Electrical Engineering, Electronics Engineering, Computer Science, or related field of study and Three (3) years of experience as a Design Release Engineer, Electrical Engineer, Vehicle Computing Engineer, or related role. Three (3) years of experience with the following: Electronic hardware design and development; Schematic and layout design for hardware solutions; Automotive electronic hardware and automotive software architecture; System-on-Chip (SoC) design and application on a module or component level; SoC architecture and workloads; and Lab equipment including power supplies, oscilloscopes, signal generator, or multimeters.

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