Principal Foundry Interface Design Engineer, HBM
$150k - $308kMicron Semiconductor Products Inc
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Job DescriptionWe are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward!In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.Responsibilities:Job DescriptionThe responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive.Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below.Foundry Interface and Technology AlignmentAct as the primary technical interface between foundry partners and Micron design organizations.Drive closure of design-process gaps through collaborative engagement with foundry process teams.Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement.Define technology requirements for future HBM and custom memory products.Circuit Simulation and AnalysisPerform HSPICE simulations for technology evaluation and design optimization.Evaluate compact models, PDK SPICE models, and process corners.Conduct pre-layout and post-layout circuit analysis.Support BEOL optimization and routing studies through simulation.Develop methodologies for evaluating design sensitivity to process variations.Test-Chip and Silicon ValidationPlan and implement technology evaluation test chips.Define process monitor structures and benchmark vehicles.Analyze post-silicon data and correlate results with simulations.Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification.PDK and Design EnablementEvaluate foundry PDKs and IP collateral.Support design teams by providing technology guidelines and best-known methods.Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies.Collaborate with CAD teams on flow enablement and validation.AI-Enabled Productivity and Efficiency ImprovementIdentify and implement AI-enabled workflows, automation opportunities, and knowledge-management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities.Minimum QualificationsBS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.6+ years of semiconductor industry experience and Solid understanding of advanced semiconductor technology developmentStrong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.Hands-on experience with: HSPICE simulations, Device characterization, Standard cell benchmarking, PPA analysis, Parasitic extraction and physical verificationExperience in driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.Preferred QualificationsExperience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.Experience with memory products including DRAM, HBM, or SRAM.Knowledge of: TSV technologies, Advanced packaging, Reliability modeling and aging simulations, Advanced BEOL technologies, PDK development and validationAbility to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), Reliability reports, Foundry collateral, Silicon characterization data,Experience leading technology pathfinding and node selection activities.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.The US base salary range that Micron Technology estimates it could pay for this full-time position is:$150,000.00 - $308,000.00 a yearAdditional compensation may include benefits, bonuses and equity.Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted onmicron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on click.appcast.io or View phone number on click.appcast.io (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.SummaryLocation: Folsom, CA; Richardson, TXType: Full time
- ...of High Bandwidth Memory (HBM) solutions for AI and ML applications... ....Micron is seeking a Design Infrastructure Engineer to build, enable, and... ...nodes as well as external foundries, such as TSMC. The... ...circuit classes like TSV interfaces, PHY-critical paths, and high...SuggestedFull timeLocal areaImmediate start
$150k - $308k
...world to learn, communicate and advance faster than ever.HBM Core-Die Architecture & Circuit Design EngineerThis role owns next‑generation HBM core‑die... ...area, thermal efficiency, and long‑term reliability. The engineer will drive architecture definition, circuit...PrincipalFull timeLocal areaImmediate start- ...world to learn, communicate and advance faster than ever.As a Principal Design Engineer, you will build the future of memory by architecting and... ...resolving critical path issuesServe as a key technical interface across design, verification, test, and technology development...PrincipalFull timeLocal areaImmediate start
- ...solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance... ..., collaborating across global engineering and product teams to deliver... ...efficiency, and reliability!As a Principal HBM Design Engineer , you will lead...PrincipalFull timeLocal areaImmediate start
- ...ResponsibilitiesVerify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness, performance, power... ...Collaborate closely with global design, architecture, product engineering, and system engineering teams to ensure successful project...PrincipalFull timeLocal areaImmediate start
- ...advance faster than ever.As a SoC Physical Design Engineer in the Heterogeneous Integration Group... ...drive the implementation of advanced HBM SoC logic/base die designs from netlist... ...., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent...Full timeLocal areaImmediate startNight shift
$121k - $247k
...and advance faster than ever.As a SoC Design Engineer, you will be part of the Heterogeneous... ...development, and integration of next‑generation HBM SoC logic die. You will work closely... ..., microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic)...Full timeLocal areaImmediate startNight shift- ...solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance... ..., collaborating across global engineering and product teams to deliver... ...architecture and high-speed memory interfaces ~ Experience indigital and/or...Full timeLocal areaImmediate start
$97k - $205k
...ever.As a Physical Verification Engineer, you will be a key technical... ...verification flows for next‑generation HBM logic die and memory‑centric... ...You will work across physical design, design rule development, EDA tool teams, foundry interfaces, and product engineering teams...Full timeLocal areaImmediate start- ...developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (... ...data-centric systems, collaborating across global engineering and product teams to deliver industry-leading...Full timeLocal areaImmediate start
- ...the development of High Bandwidth Memory (HBM) solutions for AI and ML applications.... ...per bit solutions in the industry.As a Design Engineer at Micron Technology, Inc., you will be... ...(RTL) design flow experience in DRAM or foundry processes.Experience with design for test...Full timeLocal areaImmediate start
$150k - $226k
...Seeking a Lead MMIC Design Engineer for an exciting opportunity with the MMIC Technology Center organization under Honeywell Aerospace... ...design reviews with customers; assist in mask release to the foundry; assist in manufacturing & test readiness; work in lab alongside...PrincipalPermanent employmentFull timeTemporary workWork experience placementFlexible hours$186k - $407k
...communicate and advance faster than ever.Principal ASIC Design EngineerAbout the RoleAt Micron, we... ..., ML, and advanced computing.Micron’s Interface Pathfinding team drives performance-scaling... ...execute.As the Principal ASIC Design Engineer, you will be the primary digital...PrincipalFull timeFor contractorsLocal areaImmediate start- ...role sits at the center of next‑generation HBM development. As a senior SI/PI technical... ...and impact. This role supports the design and deployment of AI-enabled solutions that... ...designsBackground working with high‑bandwidth interfaces including HBM, DDR, SERDES, or UCIeDirect...PrincipalFull timeLocal areaImmediate start
- ...advance faster than ever.Job DescriptionThe HBM Architecture team develops advanced... ...products. The team collaborates closely across design, PHY, ECC, verification, layout, and... ...Qualifications:Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field...Full timeLocal areaImmediate start
- ...inspiring the world to learn, communicate and advance faster than ever.Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced...Full timeLocal areaImmediate start
- ...into intelligence, inspiring the world to learn, communicate and advance faster than ever.Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL development, verification, and delivery of high‑performance digital...Full timeLocal areaImmediate start
- ...We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We... ...increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows,... ....Join us as a Senior Verification Engineer and contribute to modular, scalable verification...Local areaImmediate start
- ...We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We... ...increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows,... .... As a Senior Design Verification Engineer, you will collaborate closely with design...Full timeLocal areaImmediate start
- Micron Technology seeks a senior memory interface architect to own HBM IO blocks and subsystems from architectural definition through silicon bring-up and post-silicon debug. You will define PHY interfaces, clocking, training, calibration, and power-management requirements...
- ...advance faster than ever.We are seeking a Principal Analog Design Engineer to lead the design, integration, and... ...IPs for High Bandwidth Memory (HBM) products. This role is critical in developing... ..., regulators) Define and manage IP interfaces, power domains, clocking schemes, and...PrincipalFull timeLocal areaImmediate start
- ...world to learn, communicate and advance faster than ever.As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and...PrincipalFull timeLocal areaImmediate start
- ...generation High Bandwidth Memory (HBM) solutions for AI, machine... ...experienced HBM Architecture Engineer to define and drive the architecture... ...will collaborate across Design, Product Engineering, Modeling... ...equalization, timing alignment, and interface optimization.Define and...PrincipalFull timeLocal areaImmediate start
- ...Renesas is seeking an experienced Principal Verification Engineer to lead the verification efforts for... ...systems. Key Responsibilities • Design and architect mixed-signal verification... ...(LDO) regulators, and mixed-signal interfaces • Conduct in-depth RTL and Gate-...Principal
- ...Description Job Description Job Description We are seeking a Principal Design Verification Engineer to provide technical leadership for verification of next-generation semiconductor memory interface products, including data buffer silicon. This role will drive...Principal
- ...world to learn, communicate and advance faster than ever.As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and...PrincipalFull timeLocal areaImmediate start
- ...Micron Technology, Inc. in Richardson, Texas is seeking an Intern - Design Engineer for the HBM group. You will design, analyze, and optimize memory circuits for High Bandwidth Memory products, collaborating with global design and product teams to meet performance and...Internship
- ...circuits. Collaborate with various design and verification teams all... ...of groups such as Product Engineering, Test, Probe, Process Integration... ...to proactively craft HBM products that optimize all manufacturing... ...on data paths, from I/O interface to core array 2.2. Power...PrincipalFull timeLocal areaImmediate start
- ...We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We... ...increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows,... ...You will collaborate closely with Design Engineering, Product Engineering, Business Units, and...Full timeLocal areaImmediate start
- ...Join Micron’s Memory Systems Engineering team and contribute to the development... ...our high-bandwidth memory (HBM) products. This position... ..., and help maintain interface specifications for bus protocols... ...register maps, scan hooks, and design-for-test interfaces, while supporting...InternshipLocal areaImmediate start
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