Principal Foundry Interface Design Engineer, HBM
$150k - $308kMicron Semiconductor Products Inc
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Job DescriptionWe are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward!In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.Responsibilities:Job DescriptionThe responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive.Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below.Foundry Interface and Technology AlignmentAct as the primary technical interface between foundry partners and Micron design organizations.Drive closure of design-process gaps through collaborative engagement with foundry process teams.Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement.Define technology requirements for future HBM and custom memory products.Circuit Simulation and AnalysisPerform HSPICE simulations for technology evaluation and design optimization.Evaluate compact models, PDK SPICE models, and process corners.Conduct pre-layout and post-layout circuit analysis.Support BEOL optimization and routing studies through simulation.Develop methodologies for evaluating design sensitivity to process variations.Test-Chip and Silicon ValidationPlan and implement technology evaluation test chips.Define process monitor structures and benchmark vehicles.Analyze post-silicon data and correlate results with simulations.Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification.PDK and Design EnablementEvaluate foundry PDKs and IP collateral.Support design teams by providing technology guidelines and best-known methods.Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies.Collaborate with CAD teams on flow enablement and validation.AI-Enabled Productivity and Efficiency ImprovementIdentify and implement AI-enabled workflows, automation opportunities, and knowledge-management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities.Minimum QualificationsBS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.6+ years of semiconductor industry experience and Solid understanding of advanced semiconductor technology developmentStrong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.Hands-on experience with: HSPICE simulations, Device characterization, Standard cell benchmarking, PPA analysis, Parasitic extraction and physical verificationExperience in driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.Preferred QualificationsExperience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.Experience with memory products including DRAM, HBM, or SRAM.Knowledge of: TSV technologies, Advanced packaging, Reliability modeling and aging simulations, Advanced BEOL technologies, PDK development and validationAbility to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), Reliability reports, Foundry collateral, Silicon characterization data,Experience leading technology pathfinding and node selection activities.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.The US base salary range that Micron Technology estimates it could pay for this full-time position is:$150,000.00 - $308,000.00 a yearAdditional compensation may include benefits, bonuses and equity.Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted onmicron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on click.appcast.io or View phone number on click.appcast.io (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.SummaryLocation: Folsom, CA; Richardson, TXType: Full time
- Req ID: JR104068 Design Engineer- (Standard and Custom Cell Characterization) -HBM Our vision is to transform how the world uses... ...nodes as well as external foundries, such as TSMC. The position supports... ...circuit classes like TSV interfaces, PHY-critical paths, and high-...SuggestedLocal areaRelocation
$121k - $247k
...and advance faster than ever.As a SoC Design Engineer, you will be part of the Heterogeneous... ...development, and integration of next‑generation HBM SoC logic die. You will work closely... ..., microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic)...SuggestedFull timeLocal areaImmediate startNight shift- ...faster than ever. As a build Engineer at Micron Technology, Inc.,... ...development and advanced memory designs to product development,... ...workflows. Experience with memory interfaces, HBM architectures, or mixed-... ...flow experience in DRAM or foundry processes. Benefits Micron benefits...SuggestedInternshipLocal area
- New College Grad - Mixed Signal Design Engineer, HBM (Evergreen) Our vision is to transform how the world uses information to enrich life for... ...physical layer and system architects; develop and maintain interface specifications for bus protocols, clock-domain crossings,...SuggestedInternshipLocal areaRelocation
- ...Group (DEG) is a distributed team of engineers and innovators focused on advancing next... ...future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and... ...architecture, memory design concepts, and SoC/IO interfaces. Experience communicating complex...SuggestedInternshipLocal area
- ...Join Micron’s Memory Systems Engineering team and contribute to the development... ...our high-bandwidth memory (HBM) products. This position... ..., and help maintain interface specifications for bus protocols... ...register maps, scan hooks, and design-for-test interfaces, while supporting...InternshipLocal areaRelocation
- ...of the high‑bandwidth memory (HBM) base die, from micro‑... ...You will collaborate across design, verification, physical design... ...architects, and maintain clear interface specifications for bus protocols... ...corner cases, and maintain clear engineering change order (ECO) pathways....Local area
$79k - $175k
...generation High Bandwidth Memory (HBM) solutions that enable... ...collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-... ...into microarchitectures, interface definitions, and implementation...Full timeInternshipLocal areaImmediate start$171k - $296k
...leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication... ...Summary of Role: The Principal Product/Test Engineer is a senior individual... ...physical failure analysis). Interface with FAB, Assembly, and factory...PrincipalFull timeLocal area- Micron Technology is seeking an experienced SoC Design Engineer to join the Heterogeneous Integration Group, contributing to the design, development, and integration of next‑generation HBM logic die. You will work with architecture, verification, physical design, firmware...
- ...Principal HBM Design Architect Our vision is to transform how the world uses information to enrich... ...solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will... ...command/control logic, and high‑speed interface circuits Evaluate block‑level and...PrincipalLocal areaRelocation
- ...generation High Bandwidth Memory (HBM) solutions for AI, machine... ...experienced HBM Architecture Engineer to define and drive the architecture... ...will collaborate across Design, Product Engineering, Modeling... ...equalization, timing alignment, and interface optimization.Define and...PrincipalFull timeLocal areaImmediate start
- ...world to learn, communicate and advance faster than ever.As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and...PrincipalFull timeLocal areaImmediate start
- Micron Technology, Inc in Richardson, Texas, seeks a Semiconductor Design Engineer. Join a team focusing on high-bandwidth memory (HBM) products, supporting digital micro-architecture and integration tasks. Applicants should hold a Bachelor’s in Electrical or Computer Engineering...
- Micron Technology, Inc. is seeking an HBM Design Engineer Intern to contribute to the development and verification of next-generation memory solutions. You will work with experienced engineers, gaining hands-on exposure to verification methodologies, simulation environments...Internship
- ...world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable... ...computing, graphics, and data‑center applications. Our engineers collaborate across global teams to deliver innovative memory architectures...InternshipLocal area
- Micron Technology seeks an HBM Memory Design Engineer in Richardson, TX to design, analyze, and optimize digital, analog, and memory circuits for high-bandwidth memory products. You will collaborate across global design and product teams to meet manufacturability, reliability...
- Micron Technology, Inc is seeking an Engineer - HBM Design for Test (DFT) to contribute to DFT architectures across HBM core and base dies. The role focuses on implementing DFT features, defining specifications, and ensuring testability throughout tape-out, silicon bring...
- Micron Technology, Inc. is seeking an HBM Design Engineer Intern to work with memory engineers on design, simulation, and verification of HBM memory and logic circuits. You will contribute to RTL development, timing and power analysis, and functional validation in a collaborative...Internship
- Micron Technology, Inc. in Richardson, TX is seeking a New College Grad - Mixed Signal Design Engineer, HBM, to help build the digital and mixed-signal foundation of Micron's High Bandwidth Memory products. You will receive mentorship from expert engineers, contribute...
- ...and advance faster than ever. At Micron Technology, our HBM (High Bandwidth Memory) Engineering team develops advanced memory solutions that enable... ...computing applications. The team collaborates across global design, verification, and product engineering organizations to...InternshipLocal areaWorldwide
- Micron Technology, Inc. invites an Intern Design Engineer to join the HBM design team in Richardson, TX. You will work on designing, simulating, and verifying HBM memory and logic circuits, with exposure to RTL, timing, power analysis, and AI-assisted workflows across cross...Internship
- Micron Technology, Inc. is seeking a Memory Design Engineer specializing in HBM to contribute to the design, optimization, and validation of memory, logic, and analog circuits. You will collaborate with design, verification, process, and product engineering teams to deliver...
- Micron Technology is seeking an Engineer - HBM Design for Test (DFT) to define, implement, and support DFT solutions across HBM core die and base die for current and next-gen memory products. The role emphasizes working with DFT Architecture, Design Engineering, Product...
- ...to own the digital architecture and implementation of high-bandwidth memory (HBM) base die in Richardson, Texas. The ideal applicant will have at least 10 years of experience in digital design and System-on-Chip (SoC) integration, along with expertise in SystemVerilog RTL...
- ...Principal Design Engineer, Nexperia USA Inc., Richardson, TX: Job Description: Work with an analog and mixed signal IC design team to develop power management products like switching regulators, load switches, and LDO's. Define and implement circuits and architectures...PrincipalFull timeWork experience placementLocal areaRemote workMonday to Friday2 days per week
$177k - $334k
SoC Architecture and Design Engineer, Senior Member of Technical Staff (SMTS) As a SoC Architecture... ..., and integration of next‑generation HBM SoC logic die. You will work closely... ...controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic)...Local areaRelocationNight shift- Micron Technology in Richardson, Texas is seeking a skilled engineer to contribute to circuit design and validation for next-generation memory products. The role demands a Bachelor's in Electrical Engineering and 4+ years of related experience, focusing on CMOS circuits...
- 1000 Micron Technology, Inc. seeks a skilled engineer to optimize memory, logic, and analog circuits as part of their design engineering team in Richardson, Texas. Candidates should hold a Bachelor's or Master's degree in Electrical or Computer Engineering and possess strong...
- As a Build Engineer at Micron Technology, Inc., you will be responsible for crafting and analyzing digital and analog circuits used in the development of memory products, collaborating with design and verification teams worldwide and supporting multiple functional groups...Worldwide
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