HBM Architect: Mixed-Signal Design, Power & Thermal
Micron Technology
Micron Technology is seeking a Design Architect at Senior/Principal/Staff level to shape next-generation high-bandwidth memory (HBM) architectures. You will design, simulate, and optimize analog/mixed-signal circuits and power delivery for 3D-stacked memories, working with peer teams to set specifications and interfaces. The role emphasizes architecture definition, thermal/power management, and pathfinding for future stacked-memory products, with opportunities to contribute to scripting #J-18808-Ljbffr Micron Technology
Vacancy posted 5 days ago
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