Thermal & Mechanical Packaging Engineer - Data Center
Amazon Inc.
Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure. You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments. #J-18808-Ljbffr Amazon Inc.
Vacancy posted 3 days ago
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