HBM Product Failure Analysis Engineer - New Grad
Micron Technology, Inc
Micron Technology, Inc in Boise, Idaho is looking for a New College Grad to fill the HBM PYE Product Development Failure Analysis Engineer role. This position is focused on ensuring product reliability and component analysis at new HBM product introductions, utilizing electrical characterization techniques and AI tools. The ideal candidate will hold a Bachelor’s degree in Electrical Engineering, Physics, or related fields with necessary coursework in VLSI, device physics, and Python. Strong analytical and communication skills are essential for this collaborative role. #J-18808-Ljbffr Micron Technology, Inc
Vacancy posted 3 days ago
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