Thermal Engineer at Qualcomm San Diego, CA

General Summary Qualcomm is actively seeking a thermal engineer for the Design Technology (Dtech) SoC thermal analysis team. The candidate will deliver critical thermal analysis results to enable key product decisions, develop and drive implementation of new thermal analysis methodologies, and work to optimize thermally constrained SoC performance for Qualcomm's mobile and compute products. Responsibilities Support SoC design by providing thermal analysis throughout the product development cycle to identify and address thermal risks, including validation and working with external customers. Conduct SoC level thermal analysis to support architecture and product specification studies and Power Performance Area Thermal Optimization. Model and recommend SoC-level floorplan, performance, and thermal control optimization. Develop new computational thermal methodologies and software tools, implement new work processes for scalability and efficiency. Work with cross-functional and cross-organizational teams to achieve goals. Preferred Qualifications Master's or PhD in Science, Engineering, or related field. Strong background in heat transfer and fluid mechanics simulation methods and fundamentals (CFD or FEM) through graduate coursework or industry experience. Strong background in computer programming for numerical simulation and scripting skills for automation. Experience with thermal simulation methodologies and tools such as ANSYS ICEPAK. Experience with measurement: IR camera, thermocouples. Experience with thermal materials: Graphite sheet, thermal paste, TIM, heat pipe. Excellent people skills and experience operating in networked and virtual team environments. Strong oral and written communication skills capable of presenting persuasively to all levels of the organization. Required Qualifications Master's degree in Science, Engineering, or related field and 2+ years as a thermal engineer with demonstrated competence in thermal analysis methodologies, strong physics knowledge, and experience interacting with external teams. OR PhD in Science, Engineering, or related field with demonstrated competence in developing and driving thermal analysis methodologies and experience interacting with external teams. Minimum Qualifications Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related experience. OR Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related experience. OR PhD in Science, Engineering, or related field. Pay Range and Benefits Pay range: $115,600.00 - $173,400.00. Additional benefits include a competitive annual discretionary bonus program, potential annual RSU grants, and a highly competitive benefits package to support success at work, home, and play. EEO Statement Qualcomm is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected classification. #J-18808-Ljbffr Itlearn360