Thermal Engineer

Thermal Engineer – Liquid Cooling

Santa Clara, California, United States (On-site)

On-site | Santa Clara, CA

200-250k base + equity.

I’m working with a well-funded technology company developing high-performance hardware for advanced data-center applications.

They are looking for an experienced Thermal Engineer to lead the design, modeling and validation of cooling systems for high-power electronic equipment.

This is an equipment-level thermal-engineering position rather than a facilities or HVAC role. You’ll own thermal solutions from early analysis and simulation through physical testing and system integration.

You’ll work on:

• Designing heat sinks, cold plates and liquid-cooling loops
• Developing advanced air-, liquid- and two-phase-cooling solutions
• Running thermal modeling and simulation
• Conducting physical testing, validation and model correlation
• Integrating cooling systems into broader hardware architectures
• Troubleshooting thermal-performance and system-reliability issues
• Working across mechanical, electrical and system-engineering teams
• Building technical relationships with cooling-component suppliers
• Evaluating new thermal technologies and industry developments.

Looking for engineers who have:

• A bachelor’s degree in Mechanical Engineering or a related discipline, with a master’s preferred
• 10+ years of thermal-design experience
• At least two years of hands-on liquid- or two-phase-cooling design experience
• Strong knowledge of heat-transfer fundamentals
• Proficiency with Flotherm, Flotherm XT, FloEFD, Icepak or equivalent tools
• Experience taking thermal designs from modeling through physical validation
• Designed cooling solutions for high-power commercial electronic systems
• Worked closely with technical suppliers and cross-functional engineering teams.

You should also understand data-center liquid-cooling systems, including:

• In-chassis cooling loops
• Rack interfaces and associated hardware
• In-rack or in-row coolant distribution units
• Connections between equipment cooling and facility-side infrastructure.

Experience with networking, server, telecom or comparable high-power rack-mounted equipment is particularly relevant.

This is an opportunity to take ownership of technically challenging thermal systems within an experienced team developing next-generation data-center hardware.