ElectroMechanical Packaging Engineer IV, Circuit Card Packaging

Description The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Location Onsite in Littleton or Englewood, CO. No teleworking. Full‑time office schedule, 9x80 with every other Friday off. Responsibilities Support trade studies on electronic enclosure design and provide technical data for design reviews. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to ensure compliant designs. Support manufacturing and test disciplines to reduce cycle time and resolve issues. Establish specifications for contract assemblers and raw‑material vendors. Interface with Parts Engineering, Quality Assurance, and Purchasing on material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements within an Integrated Product Team. Prepare required drawings and documentation for fabrication and assembly. Key Activities Identify initial physical architecture for the Avionics subsystem. Conduct R&D trade studies during the Pre‑SRR design phase. Define requirements and frameworks for architecture and interface development throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end‑of‑year reports. Work cross‑functionally on development and integration of world‑class avionics systems. Develop electronic enclosure designs, performance and test requirements, and perform stress and thermal analysis. Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions, and Failure Review Board (FRB) as required. Resolve test anomalies and support system‑level testing. Basic Qualifications Bachelor of Science or higher in Mechanical, Aerospace, or related engineering, or equivalent experience/education. 5+ years of professional engineering experience. Full working knowledge of Geometric Dimensioning and Tolerancing (GD&T). CAD modeling and drafting experience (CREO, SolidWorks, or similar). Willingness and ability to obtain and maintain a DoD Top‑Secret clearance; US citizenship required. Desired Skills Experience with circuit card enclosure design. Knowledge of EPDM tools or equivalent. Exposure to DFx principles (Design for Affordability, Design for Manufacturability, etc.). Experience with CREO CAD modeling, Zuken, and missile/aerospace projects. Proficiency in Microsoft Office (Word, Excel, PowerPoint, MS Project). Familiarity with FBM specifications and procedures. Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, FBM Web (Livelink). Previous CPE and MRB experience. Strong communication, presentation, and interpersonal skills for technical and non‑technical audiences. Hands‑on hardware experience and experience with subcontracted hardware suppliers. Knowledge of cable manufacturing processes (connectors, crimping, soldering, forming, testing). Experience performing tolerance stack‑ups and requalification activities. Demonstrated ability to collaborate effectively within a team and with adjacent disciplines. Security Clearance This position requires a DoD Top‑Secret clearance and U.S. citizenship. Compensation Annual base salary range: $109,200 – $192,510, varying by location and qualifications. Benefits Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability. 401(k) match, Flexible Spending Accounts, Employee Assistance Program, Education Assistance. Parental Leave, Paid Time Off, Holidays. EEO Statement Lockheed Martin is an equal‑opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics. #J-18808-Ljbffr Lockheed Martin