IC Packaging Design Engineer- Contract Opportunity, Open for Corp-Corp

Q1 Technologies, Inc.

IC Packaging Design Engineer

Skills Required

This client is looking for a high level IC Package Design Engineer to help with a new product. Bachelor’s or Master’s degree in Electrical /Electronics Engineering is recquired.

Experience:

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Candidates should have experience in the below domains:

Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance

Apply

Vacancy posted 18 hours ago

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