Senior RF IC Packaging Engineer for MM-Wave SoCs
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Amazon Kuiper Manufacturing Enterprises LLC is seeking an IC Packaging Design Engineer to design mm-wave package solutions for beamforming SoCs. You will drive floorplanning, bump maps, and vendor collaboration to optimize power and performance.
You will set up 3D EM simulations, analyze SI, and work with thermal teams to ensure reliability in high-performance packaging. A strong RF background and volume-production experience are required.
#J-18808-Ljbffr Jobleads-USVacancy posted 2 days ago
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