PRINCIPAL, TECHNOLOGY ENGINEERING

Director of Engineering

The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engagement with customer engineers and technologists across their global organizations from IC design, package and system architects, manufacturing and market applications, as well as through conferences and industry forums. This position serves as the critical bridge between market demand and technology innovation, translating customer product roadmaps and industry trends into packaging technology strategies and business opportunities through deep technical dialogue, early-stage architecture influence, and ecosystem collaboration.

Working in close partnership with Sales, Factory engineering, and R&D teams, the Director aligns customer requirements with technology development roadmaps and packaging innovation strategy. Advise factory engineering teams on technology innovations and technology qualifications in collaboration with foundry partners, equipment suppliers, materials providers and industry consortia to strengthen leadership in heterogeneous integration technology. The ultimate objective is to represent the company in industry forums, conferences, and consortia to expand strategic customer partnerships, and translate advanced packaging technology leadership into sustained revenue growth and market differentiation.

The Director Engineering, Marketing & Technical Promotion is responsible for promotion of strategic technology platforms to global customers. This role provides technical leadership in engagements with customer engineering organizations, including design, technology and product development. The Director works closely with factory engineering, R&D, and Sales to align customer technology requirements with development roadmaps, and business growth objectives.

The successful candidate must be a persuasive communicator capable of engaging both technical and business audiences within the organization as well as external partners, customers, and industry professionals. Develop technology and service promotion strategies with key customers by understanding their business drivers, IC applications, system architectures, and market positions

Create technical marketing materials (presentations, white papers, and technical briefings) to effectively communicate the company's capabilities and technology differentiation

Deliver technical presentations and engage with customer design, packaging and system teams to promote and position our technologies for next-generation products

Collaborate with application engineering and Sales to promote technical capabilities, roadmaps, and manufacturing strengths

Facilitate communication between customers and internal engineering teams to address technology gaps and support product deployment. Advise internal stakeholders on customer technology trends, competitive positioning, and key technical issues

Drive technology engagements that lead to new business opportunities and design wins, increasing adoption of the company's strategic platforms

We prefer candidates with a Bachelor's, Master's, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or a related field, with 12+ years of semiconductor industry experience, preferably in semiconductor packaging or advanced packaging technologies.

Candidates should have experience managing strategic customer accounts and strong verbal, written, and interpersonal communication skills. The role requires the ability to deliver technical presentations, develop customer proposals, and provide structured progress reports.

Strong organizational and computer skills are required.

Proven ability to analyze technology and market trends to define and execute short-term and long-term business strategies

Strong understanding of semiconductor device physics, packaging technologies, and manufacturing processes, including flip chip, bumping, 2.5D/3D, high-density fan-out, and silicon photonics integration

Familiarity with emerging trends such as chiplet integration, advanced interconnects, substrate innovations, and electrical and thermo-mechanical performance optimization, and advanced manufacturing processes

Knowledge of packaging reliability, defect analysis, and qualification processes

Experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels

Experience with DOE methodologies, BOM development, and thermo-mechanical assessments

Working knowledge of engineering simulation tools (e.g., Proven strong ability to work independently and collaborate effectively with customers, vendors, and internal teams to develop and support advanced packaging technologies

Active participation in industry networks or professional societies is highly desirable

All qualified applicants will receive consideration for employment without regard to race, color, national origin, age, ancestry, religion, sex, sexual orientation, gender identity, gender expression, marital status, disability, medical condition, genetic information, pregnancy, or military or veteran status. We consider all qualified applicants, including those with criminal histories, in a manner consistent with state and local laws, including the California Fair Chance Act, City of Los Angeles' Fair Chance Initiative for Hiring Ordinance, Los Angeles County Fair Chance Ordinance, and San Francisco Fair Chance Ordinance.