Process Engineering Senior

About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localized Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localized Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste. Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About The Role
We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification.

You will work across substrate build-up processes, general microfabrication, and characterization, contributing directly to the development of next-generation device production processes and helping translate prototypes into scalable manufacturing solutions.

Responsibilities
Process Development & Fabrication

Develop and optimize Photo Imageable Dielectric (PID) and light-sensitive insulating material processes (e.g., PV-FX2 HR200) for advanced semiconductor packaging and fine-line circuit patterning

Drive multi-layer build-up process development and support translation of prototype processes into scalable, high-yield manufacturing solutions for advanced packaging

Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification (e.g., developing tool- and material-specific recipes)

Troubleshoot microfabrication defects

Cross-Functional Collaboration

Collaborate closely with Sydney team

Ensure documentation is clear and thorough

Work closely with materials scientists, chemists, and engineers to deliver prototypes and an integrated product

Support transfer of developed processes to national and international commercial fabs

Ensure clear, timely, and well-documented engagement with external suppliers

Characterization & Analysis

Perform metrology and inspection to assess process quality and reproducibility

Analyze experimental data and translate findings into process improvements

Basic reliability testing literacy in TCT, HAST, MSL.

Innovation & Continuous Improvement

Explore new lithography and fabrication techniques to improve resolution and performance

Contribute to continuous improvement of fabrication workflows and process capability

Requirements

Bachelor's degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.

Minimum 7 years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background, and the ability to support seamless process integration

Hands-on experience with commonly used photoresist coating, exposure, and development tools and processes.

Knowledge of PID materials for interposer buildup.

Experience with etching processes (ICP, RIE, CCP, and wet etching)

Experience in metallization and thin-film deposition (PECVD, PVD, etc.)

Experience working in semiconductor-grade cleanroom environments

Preferred Qualifications

Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field

10+ years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background

Experience in the semiconductor industry, particularly in advanced packaging or interposer/substrate build-up

Why Choose Syenta?
We’re building a team that takes ownership, moves fast, and solves meaningful technical challenges. At Syenta, you’ll play a central role in shaping a breakthrough manufacturing technology and see your work translate directly into real-world impact.

What We Offer

Early-stage equity opportunities

Potential 401(k) and other benefits

Comprehensive health, dental, and vision coverage plans, supported by Company

Professional Growth - We’re scaling fast, so responsibilities can expand significantly in tandem with the business

Team Events - Annual company event in Australia to collaborate and celebrate

Work-Life Balance - An understanding that meaningful work can coexist with a fulfilling personal life

15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.

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