Development Engineering Tech I

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition using sputtering PVD and PECVD, and/or others for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. The work is varied and challenging where creative problem solving opportunities are many. The work environment is mixed general office and clean room/lab.

Design and execute experiments, analyze data, draw conclusions, document, and communicate results

Establish feasibility of new processes with hands-on processing of pilot lots on production equipment

Transition knowledge to sustainment engineers or technicians

Specify, procure, and qualify new equipment as required to support development

Work with tool design engineering to make fixtures or make tool modifications

Document methods and workflows in MES-ready format

Collaborate with device physicists, research technicians, and test engineers to participate in overall product R&D cycle

Bachelor's degree or equivalent experience in related technical discipline required

Proficient computer skills - Word, Excel & Outlook

Ability to communicate clearly in written and spoken English

Strong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent a plus)

Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry

Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques

S Citizen

Plasma tools for semiconductor or MEMS fabrication

• Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)

Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​