Electronics Engineering Technology

Introduction EdgeCortix seeks to hire a talented and experienced Electronic Engineer to join our US based team and lead the design and development of our board level hardware products, including PCBAs and reference designs featuring our proprietary AI Accelerator chips.
At Edgecortix we are a deep-tech startup revolutionizing edge computing with artificial intelligence and novel high efficiency silicon on chip design. Originating from multiple years of research, our unique AI hardware & software co-design principle and the Dynamic Neural Accelerator ® AI processor IP are geared towards positively disrupting the rapidly growing artificial intelligence edge hardware space and bring the power of AI and machine learning to all kinds of devices. Our operations are headquartered in Tokyo, Japan, with offices in Singapore, Virginia, and California in the US.

We are seeking a highly skilled Senior Electronic Engineer to lead the design, development, and validation of our next-generation, high-speed PCIe-based hardware products. In this role, you will own the entire hardware development lifecycle, from initial architecture and high-speed schematic design to complex multi-layer PCB layout supervision, signal integrity analysis, hands-on lab bring-up, and transition to full production. You will collaborate closely with firmware, software, and mechanical teams to deliver robust, high-performance electronic products.

Lead the design and schematic capture of complex, multi-layer digital boards featuring power delivery networks (PDNs), high-speed SerDes and PCIe Gen 4/5/6 interfaces, BMCs, AI Accelerators, FPGAs, CPUs, and high-speed memory (e.g. Signal & Power Integrity (SI/PI): Collaborate with simulation engineers or independently utilize tools to analyze and optimize robust data transmission (e.g. eye diagrams, crosstalk, jitter), as well as clean PDNs (accuracy, noise, drop, and thermal performance).
PCB Layout Supervision: Work closely with PCB layout designers and thermal mechanical engineers to guide material and stack-up selection, high-speed routing and power delivery constraints, component placement, and thermal management strategies.
Partner with firmware and driver teams to ensure proper operation of AI acceleration workloads and integration into deployable systems.
Design for and support regulatory compliance testing including EMI/EMC, safety, protocol compliance, and interoperability, as well as validation of environmental reliability requirements.
Create and assemble reference design guides, schematics documentation, layout notes, block diagrams, operational concepts, and validation procedures to enable external customers to recreate and modify our products to do chip-down design of our AI accelerator chips. Support the Marketing team to package these materials into polished, customer-ready documentation and solutions that facilitate customer adoption and accelerate design-in activities.

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
Hands-on experience (directly or indirectly) with SI/PI simulation software (e.g., Lab/Bench Skills: Strong debugging and troubleshooting skills, proficiency with high-speed digital test equipment.
Deep understanding of high-speed data transmission and with power electronics design, including multi-phase buck converters and PMICs for high-power accelerators. Experience with, and appreciation of PCB fabrication, SMT assembly, and PCBA thermal management.
remote work permitted. The opportunity to work alongside a world-class global team across engineering, research, product, and business.
A critical role in scaling a high-growth deep-technology company.
Competitive salary, benefits, and equity participation.
Flexible work environment.
Remote-work options.